AMD_XC3S200-4FTG256C

AMD
XC3S200-4FTG256C  
FPGAs

AMD
XC3S200-4FTG256C
696-XC3S200-4FTG256C
IC FPGA 173 I/O 256FTBGA
In Stock : Please Inquiry

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ
ADD TO RFQ LIST
ersa FreeSample
ISO9001
Quality Policy
ISO45001
ISO14001

XC3S200-4FTG256C Description

The XC3S200-4FTG256C is a Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). It belongs to the Spartan-3 series of FPGAs, which are designed for a wide range of applications, including embedded systems, digital signal processing, and communication systems.

Description:

The XC3S200-4FTG256C is a mid-range FPGA with a high-density package. It features a programmable logic array that can be configured to implement a wide range of digital logic functions. The device is housed in a 256-ball FinePitch Ball Grid Array (FBGA) package, making it suitable for applications where space is limited.

Features:

  1. Programmable Logic: The XC3S200-4FTG256C features a large array of programmable logic elements (LEs) that can be configured to implement complex digital logic functions.
  2. High-Speed Transceivers: The device includes high-speed transceivers that support data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  3. Block RAM: The FPGA includes a large amount of block RAM, which can be used for data storage and processing.
  4. Digital Signal Processing (DSP) Capabilities: The XC3S200-4FTG256C includes dedicated DSP blocks that can be used for high-speed mathematical operations, making it suitable for digital signal processing applications.
  5. Low Power Consumption: The device is designed for low power consumption, making it suitable for battery-powered or energy-sensitive applications.

Applications:

The XC3S200-4FTG256C is a versatile FPGA that can be used in a wide range of applications, including:

  1. Embedded Systems: The device can be used to implement complex digital logic functions in embedded systems, such as automotive control systems, industrial control systems, and medical devices.
  2. Digital Signal Processing: The dedicated DSP blocks make the XC3S200-4FTG256C suitable for digital signal processing applications, such as audio processing, image processing, and communication systems.
  3. Communication Systems: The high-speed transceivers and low power consumption make the device suitable for communication systems, such as routers, switches, and base stations.
  4. Networking: The XC3S200-4FTG256C can be used in networking applications, such as network interface cards, firewalls, and intrusion detection systems.
  5. Test and Measurement: The device can be used in test and measurement applications, such as signal generators, oscilloscopes, and spectrum analyzers.

In summary, the XC3S200-4FTG256C is a versatile FPGA with a range of features that make it suitable for a wide range of applications. Its high-density package and low power consumption make it an ideal choice for space-constrained and energy-sensitive applications.

Tech Specifications

Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers

XC3S200-4FTG256C Documents

Download datasheets and manufacturer documentation for XC3S200-4FTG256C

Ersa XC3S200 FPGA Errata      
Ersa Spartan-3/3A/3E FPGA User Guide       Spartan-3 FPGA      
Ersa Mult DEV EOL 01/Jan/2024      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service