AMD

XC7K70T-1FBG484C  

FPGAs

XC7K70T-1FBG484C Overview

To enable more coherent data transport, a total of 285 I/Os are configured. A basic construction block has 65600 logic elements or cells. It is powered by a 1V supply voltage. This FPGA module can be mounted on the development board using a Surface Mount connector. FPGA chips run at a voltage of 0.97V1.03V and are powered by a battery. During system operation, the operating temperature should be kept between 0°C and 85°C TJ. The device includes 285 outputs to provide you with the most flexibility. This FPGA model is packed within Tray to save space.

XC7K70T-1FBG484C Features

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip chip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

XC7K70T-1FBG484C Applications

Military Temperature

Medical ultrasounds

Software-defined radio

Video & Image Processing

XC7K70T-1FBG484C Documents

Download datasheets and manufacturer documentation for XC7K70T-1FBG484C

Datasheets :

7 Series FPGA Overview       Kintex-7 FPGAs Datasheet      

PCN Design/Specification :

Mult Dev Material Chg 16/Dec/2019       Cross-Ship Lead-Free Notice 31/Oct/2016      

Environmental Information :

Xilinx REACH211 Cert       Xiliinx RoHS Cert