AMD_XC7K70T-L2FBG676E
original

AMD
XC7K70T-L2FBG676E

696-XC7K70T-L2FBG676E
IC FPGA 300 I/O 676FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
4976640
Number of LABs/CLBs
5125
ECCN
3A991D
Number of I/O
300
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FCBGA (27x27)
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XC7K70T-L2FBG676E Description

XC7K70T-L2FBG676E Overview

 

XC7K70T-L2FBG676E offers advantages such as high reliability, low power consumption, and fast operation, making them essential components in modern electronic systems. The Kintex-7 series from Xilinx Inc. is a highly efficient FPGA that has been specifically designed to meet the requirements of modern electronic systems. This device, which comes in a 676-BBGA, FCBGA package, is perfect for a wide range of applications, including surface mount systems. It boasts 300 I/Os, 4976640 logic cells, and 65600 slices. The Kintex-7 series is built to withstand harsh environments, with an operating temperature range of 0°C to 100°C. It is compliant with RoHS and halogen-free standards and is extremely popular among designers and engineers. Currently, the supply and demand for this device are balanced, with an estimated production lead time of 51 weeks. Additionally, it is unaffected by REACH regulations, making it a top choice for designers and engineers.

 

XC7K70T-L2FBG676E Features

 

Low-Power Optimization

High-Level Synthesis (HLS)

Heterogeneous System Integration

High-Speed Serial Connectivity

 

XC7K70T-L2FBG676E Applications

 

Telecommunication

Wireless Communications

Voice recognition

Embedded Vision

Audio

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