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XC7K325T-1FBG900C

XC7K325T-1FBG900C Overview

The XC7K325T-1FBG900C is an Integrated Circuit that is classified as a Field Programmable Gate Array (FPGA). It is made by Xilinx Inc. and comes in Tray packing. The device has 500 I/Os, 25475 LABs/CLBs, 326080 Logic Elements/Cells, and a total RAM bit count of 16404480. The operational temperature range is 0 to 85 degrees Celsius, and the voltage supply is 0.97V 1.03V. The gadget is frequently utilized in electronic applications like communication networks, video processing, and industrial control systems.

XC7K325T-1FBG900C Features

Endpoint and Root Port designs

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.

XC7K325T-1FBG900C Applications

Aerospace & Defense

Telecommunication

Wireless Communications

Voice recognition

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