AMD_XC7K410T-3FBG676E
original

AMD
XC7K410T-3FBG676E

696-XC7K410T-3FBG676E
IC FPGA 400 I/O 676FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
29306880
Number of LABs/CLBs
31775
ECCN
3A991D
Number of I/O
400
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FCBGA (27x27)
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XC7K410T-3FBG676E Description

XC7K410T-3FBG676E Overview

The XC7K410T-3FBG676E integrated circuit is an embedded field-programmable gate array (FPGA). It is a Kintex-7 series device with 31775 LABs/CLBs and 406720 logic elements/cells. The integrated circuit has a total RAM of 29306880 bits and can work between 0°C and 100°C (TJ). The Xilinx XC7K410T-3FBG676E is available in tray packaging and is mounted using SMD (SMT) technology. It is contained in the 676-BBGA, FCBGA package/case and has a voltage supply range of 0.97V to 1.03V. The integrated circuit features 400 I/O and is a suitable solution for a variety of applications that require an embedded FPGA.

XC7K410T-3FBG676E Features

Design security features

IP cores and ecosystem

High-speed memory interfaces

Power management features

Embedded processing capabilities

XC7K410T-3FBG676E Applications

Wireless Communications

Voice recognition

Embedded Vision

Audio

Enterprise networking

 

FAQ

What is the mounting type of XC7K410T-3FBG676E?
XC7K410T-3FBG676E uses a Surface Mount mounting style based on the listed product specifications.
What voltage specification is listed for XC7K410T-3FBG676E?
What is XC7K410T-3FBG676E?
What is the standard lead time for XC7K410T-3FBG676E?
What package or case is XC7K410T-3FBG676E available in?
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