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RFQ
AMD_XC7K325T-2FFV900I
original

AMD
XC7K325T-2FFV900I

AMD
696-XC7K325T-2FFV900I
IC FPGA 500 I/O 900FCBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
16404480
Number of LABs/CLBs
25475
ECCN
OBSOLETE
Number of I/O
500
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
900-FCBGA (31x31)
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XC7K325T-2FFV900I Description

XC7K325T-2FFV900I Overview

The XC7K325T-2FFV900I from Xilinx Inc. is an FPGA IC belonging to the Kintex-7 series. It boasts 500 I/O and is packaged in a 900-BBGA, FCBGA format. This IC can function within a temperature range of -40°C to 100°C and is widely used in the electronics industry due to its high demand and balanced supply status. It has an ECCN of 3A991D and an MSL level of 4, which means it can withstand 72 hours of exposure to moisture.

XC7K325T-2FFV900I Features

Automotive Applications

Military Temperature

Medical ultrasounds

Software-defined radio

Video & Image Processing

XC7K325T-2FFV900I Applications

Industrial Automation

Communications

Automotive

Consumer Electronics

Artificial Intelligence

FAQ

Are there related or alternative parts for XC7K325T-2FFV900I?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
What package or case is XC7K325T-2FFV900I available in?
Is XC7K325T-2FFV900I currently in stock?
What is XC7K325T-2FFV900I?
What voltage specification is listed for XC7K325T-2FFV900I?
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