AMD Tariff Inquiry

XC7K355T-1FFG901C

XC7K355T-1FFG901C Overview

The XC7K355T-1FFG901C is an FPGA within the Xilinx 7 series that is a high-capacity FPGA that was created to offer outstanding performance and versatility for a variety of applications.The device features 300 I/Os and is packaged in a 900-BBGA, FCBGA form factor. 356160 logic cells and 27825 LABs/CLBs are present in the XC7K355T-1FFG901C. The XC7K355T-1FFG901C has 26357760 total RAM bits. The XC7K355T-1FFG901C can operate in temperatures between 0°C and 85°C (TJ). In the open market, the XC7K355T-1FFG901C has a medium level of appeal and a 57 percent fake threat. The XC7K355T-1FFG901C is available in a tray package and is in limited supply. The XC7K355T-1FFG901C was released on September 24, 2010, and it has an MSL level of 3 (168 hours). The XC7K355T-1FFG901C is made in Taiwan and the Republic of Korea and has an ECCN of 3A991.d. 

XC7K355T-1FFG901C Features

Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.

XC7K355T-1FFG901C Applications

Wireless Communications

Voice recognition

Embedded Vision

Audio

Enterprise networking