FPGA chips are designed with 210 I/Os to allow for more organized data transport. A basic building block has 16640 logic cells or components. The power source is a 1V-volt supply. The development board can be connected to this FPGA module via Surface Mount connections. The device needs a supply voltage between 0.95 and 1.05 volts to function. A temperature between -40°C and 100°C TJ must be maintained at all times to guarantee a safe and effective operation. This FPGA model is packed within Tray as a space-saving technique.
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Artificial Intelligence
5G Technology
Cloud Computing
Wireless Technology
Industrial Control
Download datasheets and manufacturer documentation for XC7A15T-1CSG324I