AMD_XC3S200AN-5FTG256C
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AMD
XC3S200AN-5FTG256C

696-XC3S200AN-5FTG256C
IC FPGA 195 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
294912
Number of LABs/CLBs
448
ECCN
EAR99
Number of I/O
195
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S200AN-5FTG256C Description

The XC3S200AN-5FTG256C is a field programmable gate array (FPGA) manufactured by Advanced Micro Devices (AMD). This device is designed to provide high-performance and flexible solutions for a wide range of applications.

Description:

The XC3S200AN-5FTG256C is a member of the Spartan-3AN family of FPGAs. It features a high-density architecture and is available in a fine-pitch ball grid array (FBGA) package. The device has a total of 200 I/Os and a programmable logic array size of 5,120 logic cells.

Features:

Some of the key features of the XC3S200AN-5FTG256C include:

  1. High-performance logic elements: The device offers a high-density of logic elements, providing the ability to implement complex digital logic functions.
  2. On-chip memory: The FPGA includes a variety of on-chip memory resources, including block RAM and distributed RAM, which can be used for data storage and processing.
  3. Digital signal processing (DSP) capabilities: The device offers a range of DSP resources, including multipliers and accumulators, making it suitable for applications that require high-speed data processing.
  4. High-speed transceivers: The XC3S200AN-5FTG256C includes high-speed transceivers that support data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  5. Low power consumption: The device is designed to operate at low power levels, making it suitable for battery-powered and energy-efficient applications.

Applications:

The XC3S200AN-5FTG256C is suitable for a wide range of applications, including:

  1. Communications: The high-speed transceivers and DSP capabilities make the device suitable for high-speed communication systems, such as fiber optic communication and wireless communication.
  2. Industrial control: The device's flexibility and programmability make it suitable for industrial control applications, such as motor control and sensor interfacing.
  3. Automotive: The low power consumption and robustness of the device make it suitable for automotive applications, such as engine control and driver assistance systems.
  4. Consumer electronics: The device's high-performance and flexible logic capabilities make it suitable for consumer electronics applications, such as digital signal processing and image processing.
  5. Aerospace and defense: The device's high reliability and radiation tolerance make it suitable for aerospace and defense applications, such as satellite communication and radar systems.

Overall, the XC3S200AN-5FTG256C is a versatile and high-performance FPGA that can be used in a wide range of applications, from communications and industrial control to consumer electronics and aerospace.

FAQ

What is XC3S200AN-5FTG256C?
XC3S200AN-5FTG256C is a FPGAs from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
What package or case is XC3S200AN-5FTG256C available in?
What voltage specification is listed for XC3S200AN-5FTG256C?
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Are there related or alternative parts for XC3S200AN-5FTG256C?
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