AMD_XC3S200AN-4FTG256C
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AMD
XC3S200AN-4FTG256C

696-XC3S200AN-4FTG256C
IC FPGA 195 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
294912
Number of LABs/CLBs
448
ECCN
EAR99
Number of I/O
195
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S200AN-4FTG256C Description

The XC3S200AN-4FTG256C is a Field Programmable Gate Array (FPGA) device manufactured by AMD (now part of Xilinx). Here is a description, features, and applications of this model:

Description:

The XC3S200AN-4FTG256C is a mid-range FPGA device that belongs to the Spartan-3A family. It is designed to provide a balance between performance, power consumption, and cost, making it suitable for a wide range of applications. The device comes in a 256-ball FinePitch Ball Grid Array (FBGA) package.

Features:

  1. Performance: The XC3S200AN-4FTG256C offers a maximum operating frequency of up to 333 MHz, providing sufficient performance for many applications.
  2. Logic Elements: The device contains 200,000 logic elements (LEs), which can be used to implement a wide range of digital logic functions.
  3. Memory: The FPGA features 1.25 Mbit of block RAM (BRAM) and 1 Mbit of distributed RAM (DRAM), providing ample memory resources for data storage and processing.
  4. I/O: The XC3S200AN-4FTG256C provides 256 I/O pins, offering a high-density interface for connecting to external components and systems.
  5. Power Consumption: The device is designed for low power consumption, making it suitable for battery-powered or energy-sensitive applications.
  6. Security: The FPGA includes security features such as encryption and user-defined security options to protect intellectual property and sensitive data.
  7. Configuration: The device can be configured using a variety of methods, including on-chip serial or parallel configuration, external serial prom, or boundary-scan configuration.

Applications:

The XC3S200AN-4FTG256C is suitable for a wide range of applications, including but not limited to:

  1. Communications: The device can be used in communication systems, such as network routers, switches, and transceivers, due to its high-speed performance and I/O capabilities.
  2. Industrial Control: The FPGA can be employed in industrial control systems, where it can be used for implementing complex control algorithms and interfacing with various sensors and actuators.
  3. Automotive: The XC3S200AN-4FTG256C can be used in automotive applications, such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS), thanks to its robustness and low power consumption.
  4. Consumer Electronics: The device can be utilized in consumer electronics, such as set-top boxes, gaming consoles, and smart home devices, where it can provide the necessary processing power and I/O capabilities.
  5. Medical Devices: The FPGA can be used in medical devices, such as imaging systems, patient monitoring equipment, and diagnostic devices, due to its ability to implement complex algorithms and interface with various sensors.

In summary, the XC3S200AN-4FTG256C is a versatile FPGA device that offers a good balance between performance, power consumption, and cost. Its features make it suitable for a wide range of applications across various industries.

FAQ

What operating temperature range does XC3S200AN-4FTG256C support?
XC3S200AN-4FTG256C has an operating temperature range of 0°C ~ 85°C (TJ).
Are there related or alternative parts for XC3S200AN-4FTG256C?
What voltage specification is listed for XC3S200AN-4FTG256C?
What is the mounting type of XC3S200AN-4FTG256C?
What package or case is XC3S200AN-4FTG256C available in?
Availability (In Stock : 63 )
Quantity Unit Price Ext. Price
1+ $17.51657 $17.52
10+ $16.70743 $167.07
30+ $16.35257 $490.58
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