AMD_XC3S1400AN-4FGG676C
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AMD
XC3S1400AN-4FGG676C

696-XC3S1400AN-4FGG676C
IC FPGA 502 I/O 676FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A001A7A
Number of I/O
502
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
676-FBGA (27x27)
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XC3S1400AN-4FGG676C Description

The XC3S1400AN-4FGG676C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Virtex-5 series of FPGAs, which are known for their high performance, low power consumption, and advanced features.

Description:

The XC3S1400AN-4FGG676C is a mid-range FPGA device that offers a balance of performance, power, and cost. It features a high-density of programmable logic resources, making it suitable for a wide range of applications, from simple to complex designs. The device is available in a 676-ball fine pitch ball grid array (FBGA) package, which provides a compact and efficient form factor for use in various applications.

Features:

  1. High-performance programmable logic: The XC3S1400AN-4FGG676C features a high-density of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing blocks (DSPs), and block RAM (BRAM).
  2. Low power consumption: The device is designed to operate at low power levels, making it suitable for applications that require energy-efficient solutions.
  3. Advanced I/O capabilities: The XC3S1400AN-4FGG676C offers a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O (VIO) capabilities.
  4. On-chip debug and test features: The device includes built-in debug and test features, such as a JTAG interface and internal scan test access ports, which simplify the development and testing process.
  5. Security features: The XC3S1400AN-4FGG676C includes security features, such as encryption and secure boot, to protect intellectual property and ensure the integrity of the design.

Applications:

The XC3S1400AN-4FGG676C is suitable for a wide range of applications, including:

  1. Communications: The device can be used in various communication systems, such as base stations, routers, and switches, due to its high-speed I/O capabilities and low power consumption.
  2. Industrial control: The FPGA's programmable logic and I/O capabilities make it suitable for use in industrial control systems, such as motor control, machine vision, and process control.
  3. Automotive: The XC3S1400AN-4FGG676C can be used in automotive applications, such as advanced driver assistance systems (ADAS), infotainment systems, and body control modules, due to its reliability and security features.
  4. Medical: The device can be used in medical equipment, such as imaging systems, patient monitoring devices, and diagnostic equipment, due to its high performance and low power consumption.
  5. Consumer electronics: The XC3S1400AN-4FGG676C can be used in consumer electronics, such as gaming consoles, set-top boxes, and smart home devices, due to its versatility and advanced features.

In summary, the AMD XC3S1400AN-4FGG676C is a versatile and high-performance FPGA device that offers a balance of performance, power, and cost. Its advanced features and capabilities make it suitable for a wide range of applications, from simple to complex designs.

FAQ

What is the mounting type of XC3S1400AN-4FGG676C?
XC3S1400AN-4FGG676C uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for XC3S1400AN-4FGG676C?
What voltage specification is listed for XC3S1400AN-4FGG676C?
What operating temperature range does XC3S1400AN-4FGG676C support?
What package or case is XC3S1400AN-4FGG676C available in?
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