AMD_XC3S400AN-4FGG400I
original

AMD
XC3S400AN-4FGG400I

696-XC3S400AN-4FGG400I
IC FPGA 311 I/O 400FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
896
ECCN
3A991D
Number of I/O
311
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
400-FBGA (21x21)
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XC3S400AN-4FGG400I Description

The XC3S400AN-4FGG400I is a Field Programmable Gate Array (FPGA) device manufactured by AMD (now part of Xilinx). This device belongs to the Spartan-3A family of FPGAs, which are known for their low-cost and low-power consumption, making them suitable for a wide range of applications.

Description:

The XC3S400AN-4FGG400I is a mid-range FPGA device with a high-density package. It features 400,000 logic cells, 2,200 Digital Signal Processing (DSP) blocks, and 1,200 Input/Output (I/O) blocks. The device is available in a 4-flip chip grid array (FCGA) package, which provides a compact form factor and high I/O density.

Features:

  1. Low-cost and low-power consumption: The Spartan-3A family is designed for cost-sensitive and power-sensitive applications.
  2. High-density package: The 4-FCGA package provides a compact form factor and high I/O density, making it suitable for space-constrained applications.
  3. Large number of logic cells: With 400,000 logic cells, the XC3S400AN-4FGG400I can handle complex digital designs.
  4. DSP blocks: The device features 2,200 DSP blocks, which can be used for high-speed arithmetic operations and signal processing tasks.
  5. I/O blocks: The 1,200 I/O blocks provide a high level of connectivity and flexibility for interfacing with external components.
  6. On-chip memory: The FPGA includes block RAM (BRAM) and distributed RAM, which can be used for data storage and processing.
  7. Security features: The device includes security features such as encryption and user-level access control to protect intellectual property and sensitive data.

Applications:

The XC3S400AN-4FGG400I is suitable for a wide range of applications due to its low cost, low power consumption, and high-density packaging. Some potential applications include:

  1. Digital signal processing: The device's DSP blocks make it well-suited for applications involving high-speed data processing and analysis, such as audio, video, and communication systems.
  2. Embedded systems: The low power consumption and compact form factor make the XC3S400AN-4FGG400I suitable for use in embedded systems, such as industrial control, medical devices, and consumer electronics.
  3. Networking and communication: The device's high I/O density and connectivity make it suitable for networking and communication applications, such as routers, switches, and modems.
  4. Automotive systems: The FPGA can be used in automotive applications for tasks such as engine control, safety systems, and infotainment systems.
  5. Security systems: The device's security features make it suitable for applications involving sensitive data, such as encryption and access control systems.
  6. Test and measurement: The FPGA can be used in test and measurement equipment for tasks such as signal generation, data acquisition, and analysis.

In summary, the XC3S400AN-4FGG400I is a versatile FPGA device with a range of features that make it suitable for a wide range of applications, from digital signal processing to embedded systems and networking. Its low cost and low power consumption make it an attractive option for cost-sensitive and power-sensitive applications.

FAQ

Are there related or alternative parts for XC3S400AN-4FGG400I?
Yes. Related or alternative parts may be available on this page when relevant product data is provided.
What operating temperature range does XC3S400AN-4FGG400I support?
What is XC3S400AN-4FGG400I?
What is the mounting type of XC3S400AN-4FGG400I?
Does XC3S400AN-4FGG400I have quantity-based pricing?
Availability (In Stock : 51 )
Quantity Unit Price Ext. Price
1+ $47.65372 $47.65
30+ $45.40285 $1362.09
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