AMD_XC3S1400AN-4FG676C
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AMD
XC3S1400AN-4FG676C

696-XC3S1400AN-4FG676C
IC FPGA 502 I/O 676FCBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
2816
ECCN
3A001A7A
Number of I/O
502
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
676-FBGA (27x27)
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XC3S1400AN-4FG676C Description

The XC3S1400AN-4FG676C is a Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device belongs to the Spartan-3AN series, which is known for its high-performance, low-power, and cost-effective features.

Description:

The XC3S1400AN-4FG676C is a mid-range FPGA that offers a balance between performance, power consumption, and cost. It is designed for a wide range of applications, including embedded systems, communications, and industrial control systems. The device comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for high-density applications.

Features:

  1. Performance: The XC3S1400AN-4FG676C offers a high level of performance, with up to 1,400 Look-Up Tables (LUTs) and 130,560 flip-flops, allowing for complex designs and faster processing.
  2. Low Power Consumption: This FPGA is designed for low power consumption, making it ideal for battery-powered or energy-sensitive applications.
  3. Integrated Memory: The device includes 4 Mbit of Block RAM (BRAM) and 96 Mbit of Distributed RAM (DRAM), providing ample memory resources for various applications.
  4. I/O Capabilities: The XC3S1400AN-4FG676C features a wide range of I/O options, including differential I/Os, LVDS, and high-speed transceivers, enabling connectivity with various peripherals and communication protocols.
  5. Security Features: The device includes security features such as bitstream encryption and secure debug, ensuring the protection of intellectual property and design integrity.
  6. Configuration Flexibility: The FPGA can be easily configured and reconfigured, allowing for rapid prototyping and design changes.

Applications:

  1. Embedded Systems: The XC3S1400AN-4FG676C is well-suited for embedded systems, such as automotive control units, industrial control systems, and medical devices, due to its performance and low power consumption.
  2. Communications: The FPGA can be used in communication systems, including wireless base stations, network infrastructure, and optical networking equipment, thanks to its high-speed transceivers and I/O capabilities.
  3. Video Processing: The device is capable of handling video processing tasks, such as image and video compression, decompression, and display processing, making it suitable for applications like surveillance systems and video conferencing equipment.
  4. Military and Aerospace: The XC3S1400AN-4FG676C can be used in military and aerospace applications, where reliability, security, and performance are critical.
  5. Test and Measurement: The FPGA is suitable for test and measurement equipment, such as signal generators, oscilloscopes, and spectrum analyzers, due to its high-speed processing and I/O capabilities.

In summary, the AMD XC3S1400AN-4FG676C is a versatile and high-performance FPGA device that offers a balance between performance, power consumption, and cost. Its wide range of features and applications make it suitable for various industries and applications, including embedded systems, communications, video processing, military and aerospace, and test and measurement equipment.

FAQ

What is XC3S1400AN-4FG676C?
XC3S1400AN-4FG676C is a FPGAs from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
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