AMD_XC3S200AN-5FT256C

AMD
XC3S200AN-5FT256C  
FPGAs

AMD
XC3S200AN-5FT256C
696-XC3S200AN-5FT256C
IC FPGA 195 I/O 256FTBGA
In Stock : Please Inquiry

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ
ADD TO RFQ LIST
ersa FreeSample
ISO9001
Quality Policy
ISO45001
ISO14001

XC3S200AN-5FT256C Description

The XC3S200AN-5FT256C is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly known as Xilinx). This device is designed for use in a wide range of applications, including embedded systems, communications, and industrial control systems.

Description:

The XC3S200AN-5FT256C is a member of the Spartan-3AN family of FPGAs. It features a high-density architecture and advanced I/O capabilities, making it suitable for a wide range of applications. The device is available in a 256-ball FinePitch Ball Grid Array (FBGA) package, providing a compact form factor for use in space-constrained applications.

Features:

  1. Spartan-3AN Family: The XC3S200AN-5FT256C belongs to the Spartan-3AN family, which is known for its high performance, low power consumption, and advanced I/O capabilities.
  2. High-Density Architecture: The device offers a high-density architecture, providing a large number of programmable logic elements (PLEs) and digital signal processing (DSP) blocks for complex designs.
  3. Advanced I/O: The XC3S200AN-5FT256C features advanced I/O capabilities, including support for high-speed transceivers, making it suitable for use in high-speed communication applications.
  4. Low Power Consumption: The device is designed for low power consumption, making it ideal for use in battery-powered or energy-sensitive applications.
  5. Versatile Package: The 256-ball FinePitch Ball Grid Array (FBGA) package provides a compact form factor for use in space-constrained applications.

Applications:

The XC3S200AN-5FT256C is suitable for a wide range of applications, including:

  1. Embedded Systems: The high-density architecture and low power consumption make the XC3S200AN-5FT256C ideal for use in embedded systems, such as industrial controllers, medical devices, and automotive control systems.
  2. Communications: The advanced I/O capabilities and support for high-speed transceivers make the device suitable for use in communication applications, such as network infrastructure, wireless base stations, and optical transport systems.
  3. Industrial Control Systems: The XC3S200AN-5FT256C can be used in industrial control systems for tasks such as motor control, sensor interfacing, and process automation.
  4. Signal Processing: The device's digital signal processing (DSP) blocks make it suitable for use in signal processing applications, such as audio processing, image processing, and data acquisition systems.
  5. Test and Measurement: The XC3S200AN-5FT256C can be used in test and measurement equipment for applications such as waveform generation, data analysis, and instrumentation control.

In summary, the AMD XC3S200AN-5FT256C is a versatile and high-performance FPGA that offers a range of features and capabilities, making it suitable for use in a wide range of applications across various industries.

Tech Specifications

Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
REACH Status
Mfr
Number of Gates
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Unit Weight
Number of Logic Elements
Distributed RAM
Embedded Memory
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS

XC3S200AN-5FT256C Documents

Download datasheets and manufacturer documentation for XC3S200AN-5FT256C

Ersa XC3S200AN FPGA Errata      
Ersa Extended Spartan-3A Family Overview       Spartan-3AN FPGA Datasheet       Spartan-3AN FPGA User Guide      
Ersa Mult DEV EOL 01/Jan/2024      
Ersa Spartan-3AN FPGA Datasheet       Spartan-3AN FPGA User Guide      
Ersa Xilinx REACH211 Cert       Xiliinx RoHS Cert      

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service