AMD_XC3S200AN-5FT256C
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AMD
XC3S200AN-5FT256C

696-XC3S200AN-5FT256C
IC FPGA 195 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
294912
Number of LABs/CLBs
448
ECCN
EAR99
Number of I/O
195
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S200AN-5FT256C Description

The XC3S200AN-5FT256C is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly known as Xilinx). This device is designed for use in a wide range of applications, including embedded systems, communications, and industrial control systems.

Description:

The XC3S200AN-5FT256C is a member of the Spartan-3AN family of FPGAs. It features a high-density architecture and advanced I/O capabilities, making it suitable for a wide range of applications. The device is available in a 256-ball FinePitch Ball Grid Array (FBGA) package, providing a compact form factor for use in space-constrained applications.

Features:

  1. Spartan-3AN Family: The XC3S200AN-5FT256C belongs to the Spartan-3AN family, which is known for its high performance, low power consumption, and advanced I/O capabilities.
  2. High-Density Architecture: The device offers a high-density architecture, providing a large number of programmable logic elements (PLEs) and digital signal processing (DSP) blocks for complex designs.
  3. Advanced I/O: The XC3S200AN-5FT256C features advanced I/O capabilities, including support for high-speed transceivers, making it suitable for use in high-speed communication applications.
  4. Low Power Consumption: The device is designed for low power consumption, making it ideal for use in battery-powered or energy-sensitive applications.
  5. Versatile Package: The 256-ball FinePitch Ball Grid Array (FBGA) package provides a compact form factor for use in space-constrained applications.

Applications:

The XC3S200AN-5FT256C is suitable for a wide range of applications, including:

  1. Embedded Systems: The high-density architecture and low power consumption make the XC3S200AN-5FT256C ideal for use in embedded systems, such as industrial controllers, medical devices, and automotive control systems.
  2. Communications: The advanced I/O capabilities and support for high-speed transceivers make the device suitable for use in communication applications, such as network infrastructure, wireless base stations, and optical transport systems.
  3. Industrial Control Systems: The XC3S200AN-5FT256C can be used in industrial control systems for tasks such as motor control, sensor interfacing, and process automation.
  4. Signal Processing: The device's digital signal processing (DSP) blocks make it suitable for use in signal processing applications, such as audio processing, image processing, and data acquisition systems.
  5. Test and Measurement: The XC3S200AN-5FT256C can be used in test and measurement equipment for applications such as waveform generation, data analysis, and instrumentation control.

In summary, the AMD XC3S200AN-5FT256C is a versatile and high-performance FPGA that offers a range of features and capabilities, making it suitable for use in a wide range of applications across various industries.

FAQ

What is the mounting type of XC3S200AN-5FT256C?
XC3S200AN-5FT256C uses a Surface Mount mounting style based on the listed product specifications.
What is XC3S200AN-5FT256C?
Is XC3S200AN-5FT256C currently in stock?
Are there related or alternative parts for XC3S200AN-5FT256C?
What voltage specification is listed for XC3S200AN-5FT256C?
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