AMD_XC3S700AN-4FG484C
original

AMD
XC3S700AN-4FG484C

696-XC3S700AN-4FG484C
IC FPGA 372 I/O 484FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
1472
ECCN
3A991D
Number of I/O
372
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
484-FBGA (23x23)
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XC3S700AN-4FG484C Description

AMD's XC3S700AN-4FG484C is a high-performance Field Programmable Gate Array (FPGA) device that offers a wide range of features and applications. Here is a description of the model, its features, and potential applications:

Description:

The XC3S700AN-4FG484C is a member of the Xilinx Spartan-3AN family of FPGAs. It is a mid-range device designed to provide a balance between performance, power consumption, and cost. The device is fabricated using a 4G (four-gate) process technology, which allows for higher density and performance compared to previous generations.

Features:

  1. Performance: The XC3S700AN-4FG484C offers a high-performance solution with a maximum operating frequency of up to 500 MHz. This makes it suitable for applications that require fast processing and real-time response.

  2. Logic Density: With a logic cell count of 700,000, the XC3S700AN-4FG484C provides a good balance between logic density and performance, making it suitable for a wide range of applications.

  3. I/O Capabilities: The device offers a wide range of I/O options, including LVCMOS, 1.8V, 3.3V, and 2.5V I/O standards, making it compatible with various industry-standard interfaces.

  4. Power Management: The XC3S700AN-4FG484C includes advanced power management features, such as power-down modes and configurable power-saving options, which help reduce overall power consumption.

  5. Security: The device provides robust security features, including encryption and secure boot capabilities, to protect sensitive data and intellectual property.

  6. Configuration Options: The XC3S700AN-4FG484C supports various configuration options, including serial, parallel, and JTAG, allowing for flexible and easy device programming.

  7. Package Options: The device is available in a variety of package options, including flip-chip ball grid array (FBGA) and fine-pitch ball grid array (FBGA), to suit different board layouts and design requirements.

Applications:

  1. Communication Systems: The XC3S700AN-4FG484C is well-suited for communication systems, such as routers, switches, and transceivers, due to its high-speed processing capabilities and versatile I/O options.

  2. Industrial Control: The device can be used in industrial control applications, such as motor control, sensor interfacing, and data acquisition systems, thanks to its robustness and flexibility.

  3. Automotive Electronics: The XC3S700AN-4FG484C is suitable for automotive applications, including infotainment systems, advanced driver assistance systems (ADAS), and body control modules, due to its reliability and security features.

  4. Medical Electronics: The device can be used in medical electronics, such as imaging systems, patient monitoring devices, and diagnostic equipment, where high performance and reliability are crucial.

  5. Consumer Electronics: The XC3S700AN-4FG484C can be employed in consumer electronics, such as set-top boxes, gaming consoles, and home automation systems, to provide advanced processing capabilities and flexible connectivity options.

In summary, the AMD XC3S700AN-4FG484C is a versatile and high-performance FPGA device that offers a range of features suitable for various applications across different industries. Its balance of performance, power consumption, and cost make it an attractive choice for designers looking to implement complex digital systems.

FAQ

What package or case is XC3S700AN-4FG484C available in?
XC3S700AN-4FG484C is available in the 484-BBGA package / case.
Does XC3S700AN-4FG484C have quantity-based pricing?
What is the mounting type of XC3S700AN-4FG484C?
Is XC3S700AN-4FG484C currently in stock?
What voltage specification is listed for XC3S700AN-4FG484C?
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