AMD_XC3S200-4FTG256I
original

AMD
XC3S200-4FTG256I

696-XC3S200-4FTG256I
IC FPGA 173 I/O 256FTBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
221184
Number of LABs/CLBs
480
ECCN
EAR99
Number of I/O
173
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S200-4FTG256I Description

The XC3S200-4FTG256I is a field programmable gate array (FPGA) device manufactured by AMD (now part of Xilinx). It belongs to the Spartan-3 family of FPGAs, which are known for their low cost, low power consumption, and high integration density.

Description:

The XC3S200-4FTG256I is a mid-range FPGA with a high-density package option. It features 200,000 logic cells, 256 kilobytes of block RAM, and 552 user I/Os. The device is packaged in a 256-ball fine pitch ball grid array (FBGA) package, making it suitable for high-density applications.

Features:

  1. Low power consumption: The Spartan-3 family is designed for low power applications, making it ideal for battery-powered or energy-sensitive systems.
  2. High integration density: With 200,000 logic cells and 256 kilobytes of block RAM, the XC3S200-4FTG256I offers a high level of integration, allowing for the implementation of complex digital systems on a single device.
  3. Versatile I/O options: The device has 552 user I/Os, providing a wide range of connectivity options for interfacing with other components in a system.
  4. On-chip memory: The XC3S200-4FTG256I includes 256 kilobytes of block RAM, which can be used for data storage, caching, or other memory-intensive applications.
  5. Configurable logic blocks: The device features configurable logic blocks (CLBs) that can be programmed to implement a wide range of digital logic functions.
  6. High-performance clock management: The FPGA includes a dedicated clock management system, allowing for precise control of clock signals and enabling the implementation of synchronous or asynchronous designs.

Applications:

The XC3S200-4FTG256I is suitable for a wide range of applications, including but not limited to:

  1. Digital signal processing (DSP): The FPGA's high integration density and configurable logic make it well-suited for implementing complex DSP algorithms.
  2. Communication systems: The device's versatile I/O options and on-chip memory make it ideal for communication systems, such as network routers, switches, and transceivers.
  3. Industrial control systems: The low power consumption and high integration density of the XC3S200-4FTG256I make it suitable for battery-powered or energy-sensitive industrial control applications.
  4. Automotive systems: The device's robustness and reliability make it suitable for use in automotive applications, such as engine control units, safety systems, and infotainment systems.
  5. Medical equipment: The FPGA's low power consumption and high integration density make it suitable for battery-powered or energy-sensitive medical equipment, such as portable diagnostic devices and wearable health monitors.

In summary, the XC3S200-4FTG256I is a versatile FPGA device with a high-density package option, making it suitable for a wide range of applications, including digital signal processing, communication systems, industrial control, automotive systems, and medical equipment. Its low power consumption, high integration density, and versatile I/O options make it an attractive choice for designers looking to implement complex digital systems on a single device.

FAQ

What voltage specification is listed for XC3S200-4FTG256I?
The listed voltage-related specification for XC3S200-4FTG256I is 1.14V ~ 1.26V.
Is XC3S200-4FTG256I currently in stock?
What package or case is XC3S200-4FTG256I available in?
Does XC3S200-4FTG256I have quantity-based pricing?
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