AMD_XC3S200-4TQ144C
original

AMD
XC3S200-4TQ144C

696-XC3S200-4TQ144C
IC FPGA 97 I/O 144TQFP

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
221184
Number of LABs/CLBs
480
ECCN
EAR99
Number of I/O
97
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
144-TQFP (20x20)
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XC3S200-4TQ144C Description

The XC3S200-4TQ144C is a Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3 family of FPGAs, which are known for their high performance, low power consumption, and small form factor.

Description:

The XC3S200-4TQ144C is a mid-range FPGA device that offers a range of features and capabilities. It has a programmable logic array that can be configured to perform a wide variety of functions, making it highly versatile for a range of applications. The device is available in a 144-ball fine pitch ball grid array (FBGA) package, which allows for high-density integration in a compact form factor.

Features:

Some of the key features of the XC3S200-4TQ144C include:

  1. High-performance programmable logic: The device offers a high-performance programmable logic fabric that can be configured to perform a wide range of functions.
  2. Low power consumption: The Spartan-3 family of FPGAs is known for its low power consumption, making it well-suited for battery-powered and energy-sensitive applications.
  3. Small form factor: The 144-ball FBGA package allows for high-density integration in a compact form factor, making it ideal for applications where space is at a premium.
  4. On-chip memory: The XC3S200-4TQ144C includes on-chip memory resources, including block RAM and distributed RAM, which can be used for a variety of functions.
  5. Digital signal processing (DSP) capabilities: The device includes dedicated DSP blocks that can be used for high-speed data processing and manipulation.
  6. High-speed I/O: The XC3S200-4TQ144C supports high-speed I/O interfaces, including LVDS and DDR, making it well-suited for high-speed data communication applications.

Applications:

The XC3S200-4TQ144C is a versatile FPGA device that can be used in a wide range of applications, including:

  1. Communications: The high-speed I/O and DSP capabilities of the device make it well-suited for applications in the communications industry, such as network infrastructure and wireless base stations.
  2. Industrial control: The device's programmable logic and on-chip memory resources make it well-suited for applications in industrial control and automation.
  3. Consumer electronics: The low power consumption and small form factor of the XC3S200-4TQ144C make it ideal for use in battery-powered consumer electronics, such as portable devices and smart home appliances.
  4. Automotive: The device's robustness and reliability make it well-suited for use in automotive applications, such as infotainment systems and advanced driver assistance systems (ADAS).
  5. Aerospace and defense: The XC3S200-4TQ144C's high performance and low power consumption make it well-suited for use in aerospace and defense applications, such as satellite communications and radar systems.

In summary, the XC3S200-4TQ144C is a versatile and high-performance FPGA device that offers a range of features and capabilities. Its low power consumption, small form factor, and high-speed I/O make it well-suited for a wide range of applications, from communications and industrial control to consumer electronics and aerospace and defense.

FAQ

What operating temperature range does XC3S200-4TQ144C support?
XC3S200-4TQ144C has an operating temperature range of 0°C ~ 85°C (TJ).
Are there related or alternative parts for XC3S200-4TQ144C?
What is the mounting type of XC3S200-4TQ144C?
Does XC3S200-4TQ144C have quantity-based pricing?
What package or case is XC3S200-4TQ144C available in?
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