AMD
XC3S200-5TQG144C

696-XC3S200-5TQG144C
IC FPGA 97 I/O 144TQFP

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
221184
Number of LABs/CLBs
480
ECCN
EAR99
Number of I/O
97
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
144-TQFP (20x20)
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XC3S200-5TQG144C Description

The XC3S200-5TQG144C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family. This device is designed to provide a flexible and customizable solution for a wide range of applications, including embedded systems, digital signal processing, and communications.

Description:

The XC3S200-5TQG144C is a mid-range FPGA that offers a balance between performance, power consumption, and cost. It features a high-density architecture with up to 200,000 logic cells and 16,000 flip-flops, making it suitable for complex designs and demanding applications.

Features:

  1. High-density architecture: The XC3S200-5TQG144C provides a high-density of logic elements, flip-flops, and I/O resources, allowing for the implementation of complex designs in a compact form factor.
  2. Low power consumption: The device is designed to operate at low power levels, making it ideal for battery-powered or energy-sensitive applications.
  3. Enhanced I/O capabilities: The XC3S200-5TQG144C offers a wide range of I/O options, including LVCMOS, LVDS, and LVTTL, providing flexibility in interfacing with various peripherals and systems.
  4. On-chip memory: The FPGA includes block RAM and distributed RAM resources, enabling the implementation of memory-intensive designs.
  5. High-speed transceivers: The device features high-speed transceivers that support data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  6. Configurable logic blocks: The XC3S200-5TQG144C utilizes configurable logic blocks that can be programmed to perform a variety of functions, providing a high level of design flexibility.

Applications:

  1. Embedded systems: The XC3S200-5TQG144C is well-suited for embedded systems that require customizable logic and I/O capabilities, such as industrial control systems, automotive electronics, and consumer devices.
  2. Digital signal processing: The FPGA's high-density architecture and on-chip memory make it an excellent choice for digital signal processing applications, including image and video processing, audio processing, and communication systems.
  3. Communications: The high-speed transceivers and flexible I/O options of the XC3S200-5TQG144C make it suitable for communication applications, such as wireless base stations, network infrastructure, and high-speed data transmission systems.
  4. Test and measurement: The device's customizable logic and I/O capabilities make it ideal for test and measurement equipment, including signal generators, oscilloscopes, and spectrum analyzers.
  5. Military and aerospace: The XC3S200-5TQG144C can be used in military and aerospace applications that require high reliability, low power consumption, and customizable logic capabilities, such as radar systems, satellite communication, and navigation systems.

FAQ

What voltage specification is listed for XC3S200-5TQG144C?
The listed voltage-related specification for XC3S200-5TQG144C is 1.14V ~ 1.26V.
What is XC3S200-5TQG144C?
Does XC3S200-5TQG144C have quantity-based pricing?
Is XC3S200-5TQG144C currently in stock?
What is the mounting type of XC3S200-5TQG144C?
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