AMD
XC3S250E-4TQ144I

696-XC3S250E-4TQ144I
IC FPGA 108 I/O 144TQFP

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
221184
Number of LABs/CLBs
612
ECCN
3A001A7B
Number of I/O
108
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
144-TQFP (20x20)
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XC3S250E-4TQ144I Description

The XC3S250E-4TQ144I is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Virtex-E family of FPGAs, which are designed for a wide range of applications in various industries.

Description:

The XC3S250E-4TQ144I is a high-performance FPGA that offers a combination of features and capabilities to meet the demands of complex digital designs. It is available in a 144-ball fine pitch ball grid array (FPBGA) package, which provides a compact and efficient form factor for use in various applications.

Features:

  1. Advanced 90nm manufacturing process: The XC3S250E-4TQ144I is built using a 90nm process technology, which enables high performance, low power consumption, and increased density of logic elements.
  2. High-density logic elements: The device features a large number of configurable logic blocks (CLBs) and digital signal processing blocks (DSPs) to provide the flexibility needed for complex digital designs.
  3. On-chip memory: The XC3S250E-4TQ144I includes a variety of memory resources, such as block RAM (BRAM) and distributed RAM, to support data storage and processing requirements.
  4. High-speed I/O: The device offers a wide range of high-speed I/O options, including differential signaling and multi-gigabit transceivers, to support various communication protocols and interfaces.
  5. Integrated hard intellectual property (IP): The XC3S250E-4TQ144I includes a range of pre-verified and pre-configured IP cores, such as memory controllers, serializers/deserializers, and clock management circuits, to simplify design implementation and reduce development time.
  6. Advanced power management: The device features advanced power management techniques, such as power-down modes and dynamic voltage scaling, to optimize power consumption for various operating conditions.

Applications:

The XC3S250E-4TQ144I FPGA is suitable for a wide range of applications, including but not limited to:

  1. Communications: The high-speed I/O and advanced DSP capabilities make the XC3S250E-4TQ144I ideal for use in communication systems, such as base stations, routers, and switches.
  2. Industrial control: The device's flexibility and robustness make it suitable for use in industrial control applications, such as motor control, robotics, and process automation.
  3. Automotive: The XC3S250E-4TQ144I can be used in various automotive applications, including infotainment systems, advanced driver assistance systems (ADAS), and powertrain control.
  4. Consumer electronics: The device's compact form factor and low power consumption make it suitable for use in consumer electronics, such as smartphones, tablets, and wearable devices.
  5. Aerospace and defense: The XC3S250E-4TQ144I can be used in aerospace and defense applications, such as radar systems, satellite communication, and electronic warfare.

In summary, the AMD XC3S250E-4TQ144I is a versatile and high-performance FPGA that offers a range of features and capabilities to meet the demands of complex digital designs across various industries.

FAQ

What is the mounting type of XC3S250E-4TQ144I?
XC3S250E-4TQ144I uses a Surface Mount mounting style based on the listed product specifications.
What is XC3S250E-4TQ144I?
What operating temperature range does XC3S250E-4TQ144I support?
What package or case is XC3S250E-4TQ144I available in?
Does XC3S250E-4TQ144I have quantity-based pricing?
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