AMD_XC3S4000-5FGG900C
original

AMD
XC3S4000-5FGG900C

696-XC3S4000-5FGG900C
IC FPGA 633 I/O 900FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
1769472
Number of LABs/CLBs
6912
ECCN
3A001A7A
Number of I/O
633
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
900-FBGA (31x31)
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XC3S4000-5FGG900C Description

The XC3S4000-5FGG900C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3A series, which is designed for high-performance and low-power applications.

Description:

The XC3S4000-5FGG900C is a high-density FPGA that offers a combination of versatility, performance, and power efficiency. It is packaged in a 900-ball fine pitch ball grid array (FBGA) package, making it suitable for a wide range of applications that require a compact form factor.

Features:

  1. High-density architecture: The XC3S4000-5FGG900C provides a high-density architecture with up to 4,000 logic cells, allowing for the implementation of complex designs and functions.
  2. Low power consumption: The device is designed for low power consumption, making it suitable for battery-powered and energy-sensitive applications.
  3. Enhanced I/O capabilities: The XC3S4000-5FGG900C offers a wide range of I/O capabilities, including support for high-speed transceivers, making it suitable for communication and data transfer applications.
  4. On-chip memory: The device includes a variety of on-chip memory resources, such as block RAM and distributed RAM, providing flexible memory options for different applications.
  5. Digital signal processing (DSP) capabilities: The XC3S4000-5FGG900C offers DSP slices for high-speed arithmetic operations, making it suitable for signal processing and data-intensive applications.
  6. Security features: The device includes security features, such as encryption and authentication, to protect intellectual property and ensure data integrity.

Applications:

The XC3S4000-5FGG900C is suitable for a wide range of applications due to its high performance, low power consumption, and versatile features. Some potential applications include:

  1. Communication systems: The high-speed transceivers and I/O capabilities make the XC3S4000-5FGG900C suitable for communication systems, such as network routers, switches, and base stations.
  2. Industrial control systems: The device's versatility and low power consumption make it suitable for industrial control systems, such as motor control and sensor processing.
  3. Automotive systems: The XC3S4000-5FGG900C can be used in various automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and body control modules.
  4. Consumer electronics: The device's compact form factor and low power consumption make it suitable for consumer electronics, such as smartphones, tablets, and wearable devices.
  5. Security systems: The security features of the XC3S4000-5FGG900C make it suitable for security systems, such as encryption and authentication applications.
  6. Signal processing: The DSP capabilities of the device make it suitable for signal processing applications, such as image and video processing, audio processing, and medical imaging.

In summary, the AMD XC3S4000-5FGG900C is a high-performance, low-power FPGA that offers a wide range of features and capabilities, making it suitable for various applications across different industries.

FAQ

What is the mounting type of XC3S4000-5FGG900C?
XC3S4000-5FGG900C uses a Surface Mount mounting style based on the listed product specifications.
What is XC3S4000-5FGG900C?
Are there related or alternative parts for XC3S4000-5FGG900C?
Does XC3S4000-5FGG900C have quantity-based pricing?
Is XC3S4000-5FGG900C currently in stock?
Availability (In Stock : 3 )
Quantity Unit Price Ext. Price
1+ $299.72800 $299.73
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