AMD_XC3S400A-4FG400I
original

AMD
XC3S400A-4FG400I

696-XC3S400A-4FG400I
IC FPGA 311 I/O 400FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
896
ECCN
3A991D
Number of I/O
311
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
400-FBGA (21x21)
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XC3S400A-4FG400I Description

The XC3S400A-4FG400I is a high-performance Field Programmable Gate Array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3A family of FPGAs, which are designed for a wide range of applications, including embedded systems, communications, and consumer electronics.

Description:

The XC3S400A-4FG400I is a mid-range FPGA with a high-density architecture and advanced features. It is available in a 4-layer Fine-Pitch Ball Grid Array (FBGA) package, which provides a compact and efficient solution for space-constrained applications. The device has a total of 400 I/O (input/output) pins, making it suitable for complex designs that require a large number of external connections.

Features:

  1. High-density architecture: The XC3S400A-4FG400I offers a high-density architecture, which allows for the implementation of complex designs with a smaller form factor.
  2. Advanced I/O capabilities: The device provides a wide range of I/O options, including LVCMOS, LVDS, and LVTTL, making it suitable for various interface requirements.
  3. On-chip memory: The XC3S400A-4FG400I includes on-chip memory resources, such as block RAM and distributed RAM, which can be used for data storage and processing tasks.
  4. Digital signal processing (DSP) capabilities: The FPGA features dedicated DSP blocks, which can be used for high-speed mathematical operations and signal processing tasks.
  5. High-speed transceivers: The device includes high-speed transceivers, which can support data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  6. Low power consumption: The Spartan-3A family of FPGAs is designed for low power consumption, making it ideal for battery-powered and energy-efficient applications.
  7. Configurable logic blocks: The XC3S400A-4FG400I features configurable logic blocks, which can be programmed to perform a wide range of logical functions and operations.

Applications:

The XC3S400A-4FG400I is suitable for a wide range of applications, including:

  1. Embedded systems: The device can be used in embedded systems for control, data processing, and communication tasks.
  2. Communications: The high-speed transceivers and advanced I/O capabilities make the XC3S400A-4FG400I suitable for communication applications, such as networking equipment and base stations.
  3. Consumer electronics: The FPGA can be used in consumer electronics, such as set-top boxes, gaming consoles, and multimedia devices, for processing and control tasks.
  4. Industrial control: The device can be used in industrial control systems for monitoring, control, and automation tasks.
  5. Automotive: The XC3S400A-4FG400I can be used in automotive applications for infotainment systems, advanced driver assistance systems (ADAS), and control systems.
  6. Aerospace and defense: The FPGA can be used in aerospace and defense applications for signal processing, communication, and control systems.

In summary, the AMD XC3S400A-4FG400I is a versatile and high-performance FPGA device that offers a range of features and capabilities suitable for various applications across different industries. Its high-density architecture, advanced I/O capabilities, and low power consumption make it an ideal choice for complex and space-constrained designs.

FAQ

What operating temperature range does XC3S400A-4FG400I support?
XC3S400A-4FG400I has an operating temperature range of -40°C ~ 100°C (TJ).
Are there related or alternative parts for XC3S400A-4FG400I?
Is XC3S400A-4FG400I currently in stock?
What is XC3S400A-4FG400I?
What voltage specification is listed for XC3S400A-4FG400I?
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