AMD_XC3S500E-5PQG208C
original

AMD
XC3S500E-5PQG208C

696-XC3S500E-5PQG208C
IC FPGA 158 I/O 208QFP

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
368640
Number of LABs/CLBs
1164
ECCN
EAR99
Number of I/O
158
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
208-PQFP (28x28)
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XC3S500E-5PQG208C Description

The XC3S500E-5PQG208C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Virtex-5 family of FPGAs, which are designed for high-performance and high-density applications.

Description:

The XC3S500E-5PQG208C is a mid-range Virtex-5 FPGA that offers a balance of performance, power, and cost. It features a high-density architecture with up to 333 million system gates and up to 3,456 digital signal processing (DSP) slices. The device is available in a 208-ball fine pitch ball grid array (FBGA) package, making it suitable for a wide range of applications.

Features:

  1. High-performance logic cells: The XC3S500E-5PQG208C features advanced logic cells that provide high performance and low power consumption.
  2. High-density memory resources: The device offers up to 12.8 million bits of block RAM (BRAM) and up to 1,024 kilobytes of ultra-RAM (URAM) for high-density memory applications.
  3. Digital signal processing (DSP) capabilities: With up to 3,456 DSP slices, the XC3S500E-5PQG208C is well-suited for applications that require high-speed signal processing.
  4. High-speed transceivers: The device supports up to 3.125 Gbps transceiver data rates, making it suitable for high-speed communication applications.
  5. Integrated hard intellectual property (IP): The XC3S500E-5PQG208C includes a range of pre-verified and pre-integrated IP, such as PCI Express, Gigabit Ethernet, and DDR memory controllers, to speed up design and development.
  6. Advanced power management: The device features advanced power management techniques, such as power-down modes and dynamic power scaling, to optimize power consumption.

Applications:

The XC3S500E-5PQG208C is suitable for a wide range of applications, including:

  1. High-speed communication systems: Due to its high-speed transceivers and advanced logic cells, the device is well-suited for applications such as 5G base stations, optical transport networks, and high-speed data centers.
  2. Video processing: The high-density memory resources and DSP capabilities make the XC3S500E-5PQG208C ideal for video processing applications, such as video encoding, decoding, and image processing.
  3. Industrial control systems: The device's robustness and flexibility make it suitable for industrial control systems, such as motor control, robotics, and automation.
  4. Aerospace and defense: The XC3S500E-5PQG208C can be used in aerospace and defense applications, such as radar processing, signal intelligence, and electronic warfare systems.
  5. Medical imaging: The device's high-performance capabilities make it suitable for medical imaging applications, such as computed tomography (CT), magnetic resonance imaging (MRI), and ultrasound systems.

In summary, the AMD XC3S500E-5PQG208C is a versatile and powerful FPGA device that offers a balance of performance, power, and cost. Its high-density architecture, advanced features, and wide range of applications make it an excellent choice for a variety of high-performance and high-density applications.

FAQ

What operating temperature range does XC3S500E-5PQG208C support?
XC3S500E-5PQG208C has an operating temperature range of 0°C ~ 85°C (TJ).
Is XC3S500E-5PQG208C currently in stock?
What is the mounting type of XC3S500E-5PQG208C?
What voltage specification is listed for XC3S500E-5PQG208C?
Are there related or alternative parts for XC3S500E-5PQG208C?
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