AMD

XC7A100T-3FTG256E  

FPGAs

XC7A100T-3FTG256E Overview

The AMD Xilinx XC7A100T-3FTG256E is an integrated circuit embedded FPGA. It comes with a regular package of 90. It is a surface mount device (SMD) mounted and contains 170 I/Os. The total number of LABs/CLBs is 7925, with a total of 101440 logic elements/cells. It contains 4976640 bits of RAM and requires a power supply of 0.95V 1.05V. 256-LBGA is the packaging or case, while 256-FTBGA (17x17) is the supplier device package. In the open market, this product has a fake danger of 63%. It is not subject to REACH and has an ECCN of EAR99.

XC7A100T-3FTG256E Features

Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip chip packaging offering easy migration between family members in the same package.

All packages available in Pb-free and selected packages in Pb option

Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering

XC7A100T-3FTG256E Applications

Wireless Technology

Industrial Control

Internet of Things

Medical Equipment

XC7A100T-3FTG256E Documents

Download datasheets and manufacturer documentation for XC7A100T-3FTG256E

Errata :

XC7A100T/200T Errata      

Datasheets :

7 Series FPGA Overview       Artix-7 FPGAs Datasheet       Artix-7 FPGAs Brief      

Environmental Information :

Xilinx REACH211 Cert       Xiliinx RoHS Cert