AMD_XCKU3P-2FFVB676I
original

AMD
XCKU3P-2FFVB676I

696-XCKU3P-2FFVB676I
IC FPGA 280 I/O 676FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
31641600
Number of LABs/CLBs
20340
ECCN
3A991D
Number of I/O
280
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
676-FCBGA (27x27)
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XCKU3P-2FFVB676I Description

AMD XCKU3P-2FFVB676I is a high-performance FPGA (Field Programmable Gate Array) module developed by Advanced Micro Devices (AMD). It is designed to provide advanced functionality and high-speed processing capabilities for a wide range of applications.

Description:

The XCKU3P-2FFVB676I is a versatile FPGA module that features a Xilinx Kintex UltraScale+ KU3P FPGA chip. It is a high-density module that offers a combination of high-performance processing, low-power consumption, and advanced I/O capabilities. The module is designed to be used in a variety of applications, including telecommunications, military, aerospace, and industrial control systems.

Features:

  1. Xilinx Kintex UltraScale+ KU3P FPGA chip: The XCKU3P-2FFVB676I features a powerful FPGA chip that provides high-speed processing and advanced functionality.
  2. High-density module: The module is designed to be compact and high-density, making it ideal for applications where space is at a premium.
  3. Low-power consumption: The XCKU3P-2FFVB676I is designed to be energy-efficient, making it suitable for applications where power consumption is a critical factor.
  4. Advanced I/O capabilities: The module features a range of I/O options, including high-speed serial interfaces, making it suitable for a wide range of applications.
  5. Versatile: The XCKU3P-2FFVB676I is a highly versatile module that can be used in a variety of applications, including telecommunications, military, aerospace, and industrial control systems.

Applications:

  1. Telecommunications: The XCKU3P-2FFVB676I is ideal for use in telecommunications applications, where high-speed processing and advanced I/O capabilities are required.
  2. Military: The module's high-density and low-power consumption make it well-suited for military applications, where space and power are critical factors.
  3. Aerospace: The XCKU3P-2FFVB676I is designed to meet the rigorous requirements of aerospace applications, where reliability and performance are crucial.
  4. Industrial control systems: The module's advanced functionality and high-speed processing capabilities make it ideal for use in industrial control systems, where precise control and monitoring are required.

Overall, the AMD XCKU3P-2FFVB676I is a high-performance FPGA module that offers a range of advanced features and capabilities. It is designed to be versatile and can be used in a variety of applications, making it a valuable tool for engineers and developers working on complex projects.

FAQ

Is XCKU3P-2FFVB676I currently in stock?
Yes. XCKU3P-2FFVB676I currently shows 81 unit(s) in stock.
What operating temperature range does XCKU3P-2FFVB676I support?
What voltage specification is listed for XCKU3P-2FFVB676I?
Are there related or alternative parts for XCKU3P-2FFVB676I?
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Availability (In Stock : 81 )
Quantity Unit Price Ext. Price
1+ $130.62515 $130.63
40+ $124.09715 $4963.89
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Unit Price $130.62515
Subtotal $130.63
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