AMD_XCKU3P-1FFVD900E
original

AMD
XCKU3P-1FFVD900E

696-XCKU3P-1FFVD900E
IC FPGA 304 I/O 900FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
31641600
Number of LABs/CLBs
20340
ECCN
3A991D
Number of I/O
304
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
900-FCBGA (31x31)
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XCKU3P-1FFVD900E Description

AMD's XCKU3P-1FFVD900E is a high-performance integrated circuit (IC) designed for use in a wide range of applications. This IC is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and high-performance processing capabilities.

Description:

The XCKU3P-1FFVD900E is a field-programmable gate array (FPGA) that offers a high level of flexibility and customization. It is based on a 28 nm process technology and features a high-density architecture, making it ideal for use in complex and demanding applications.

Features:

Some of the key features of the XCKU3P-1FFVD900E include:

  1. High-performance processing capabilities: The XCKU3P-1FFVD900E is designed to deliver exceptional processing performance, making it suitable for use in applications that require high-speed data processing and complex computations.
  2. Advanced programmable logic: The FPGA is highly programmable, allowing users to customize its logic functions to meet their specific needs.
  3. High-density architecture: The XCKU3P-1FFVD900E features a high-density architecture, which enables it to support a large number of input/output (I/O) ports and other functions in a compact form factor.
  4. Low power consumption: The IC is designed to operate with low power consumption, making it suitable for use in energy-sensitive applications.
  5. Robust design: The XCKU3P-1FFVD900E is built to meet the stringent requirements of industrial and automotive applications, ensuring reliable operation in harsh environments.

Applications:

The XCKU3P-1FFVD900E is suitable for use in a wide range of applications, including:

  1. Telecommunications: The high-performance processing capabilities and advanced programmable logic of the XCKU3P-1FFVD900E make it ideal for use in telecommunications applications, such as signal processing and network infrastructure.
  2. Industrial automation: The robust design and low power consumption of the IC make it well-suited for use in industrial automation applications, such as motor control and machine vision.
  3. Automotive: The XCKU3P-1FFVD900E is designed to meet the stringent requirements of automotive applications, making it suitable for use in advanced driver assistance systems (ADAS) and other in-vehicle electronics.
  4. Aerospace and defense: The high reliability and performance of the IC make it suitable for use in aerospace and defense applications, such as radar and satellite communications.
  5. High-performance computing: The XCKU3P-1FFVD900E can be used in high-performance computing applications, such as data centers and supercomputing, where high-speed processing and complex computations are required.

Overall, the AMD XCKU3P-1FFVD900E is a versatile and high-performance IC that offers a range of features and capabilities suitable for use in a wide range of applications. Its advanced programmable logic, high-density architecture, and robust design make it an excellent choice for demanding applications that require high-speed processing and customization.

FAQ

Is XCKU3P-1FFVD900E currently in stock?
Yes. XCKU3P-1FFVD900E currently shows 2 unit(s) in stock.
Are there related or alternative parts for XCKU3P-1FFVD900E?
What is the mounting type of XCKU3P-1FFVD900E?
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Availability (In Stock : 2 )
Quantity Unit Price Ext. Price
1+ $1371.70000 $1371.70
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