AMD's XCKU15P-3FFVE1760E is a high-performance integrated circuit (IC) designed for use in a wide range of applications. This IC is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and high-performance processing capabilities.
Description:
The XCKU15P-3FFVE1760E is a field programmable gate array (FPGA) that offers a combination of high performance, low power consumption, and advanced processing capabilities. It is based on a 16-nanometer (nm) process technology and features a high-density architecture that allows for the integration of a large number of gates and other digital logic elements.
Features:
Some of the key features of the XCKU15P-3FFVE1760E include:
High-performance processing: The XCKU15P-3FFVE1760E is designed to deliver high-performance processing capabilities for a wide range of applications, including data processing, signal processing, and image processing.
Low power consumption: The IC is designed to operate at low power levels, making it suitable for use in energy-sensitive applications.
High-density architecture: The high-density architecture of the XCKU15P-3FFVE1760E allows for the integration of a large number of gates and other digital logic elements, providing a high level of flexibility and customization.
Advanced programmability: The IC is highly programmable, allowing it to be configured for a wide range of applications and use cases.
Robust design: The XCKU15P-3FFVE1760E is designed to be robust and reliable, with features such as error-correcting code (ECC) memory and built-in self-test (BIST) capabilities.
Applications:
The XCKU15P-3FFVE1760E is suitable for use in a wide range of applications, including:
Telecommunications: The IC can be used in telecommunications infrastructure, such as base stations and routers, to provide high-performance processing capabilities.
Industrial automation: The IC can be used in industrial automation systems to provide real-time control and processing capabilities.
Automotive: The IC can be used in automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems, to provide high-performance processing capabilities.
Aerospace and defense: The IC can be used in aerospace and defense applications, such as radar systems and satellite communications, to provide high-performance processing capabilities.
Data centers: The IC can be used in data centers to provide high-performance processing capabilities for data processing and analysis.
Overall, the XCKU15P-3FFVE1760E is a high-performance, low-power FPGA that offers a wide range of features and capabilities, making it suitable for use in a variety of applications.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XCKU15P-3FFVE1760E Documents
Download datasheets and manufacturer documentation for XCKU15P-3FFVE1760E
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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