AMD_XCKU15P-3FFVE1760E
original

AMD
XCKU15P-3FFVE1760E

696-XCKU15P-3FFVE1760E
IC FPGA 668 I/O 1760FCBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 100°C (TJ)
Total RAM Bits
82329600
Number of LABs/CLBs
65340
ECCN
3A001A7B
Number of I/O
668
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1760-FCBGA (42.5x42.5)
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XCKU15P-3FFVE1760E Description

AMD's XCKU15P-3FFVE1760E is a high-performance integrated circuit (IC) designed for use in a wide range of applications. This IC is part of AMD's Xilinx product line, which is known for its advanced programmable logic devices and high-performance processing capabilities.

Description:

The XCKU15P-3FFVE1760E is a field programmable gate array (FPGA) that offers a combination of high performance, low power consumption, and advanced processing capabilities. It is based on a 16-nanometer (nm) process technology and features a high-density architecture that allows for the integration of a large number of gates and other digital logic elements.

Features:

Some of the key features of the XCKU15P-3FFVE1760E include:

  1. High-performance processing: The XCKU15P-3FFVE1760E is designed to deliver high-performance processing capabilities for a wide range of applications, including data processing, signal processing, and image processing.
  2. Low power consumption: The IC is designed to operate at low power levels, making it suitable for use in energy-sensitive applications.
  3. High-density architecture: The high-density architecture of the XCKU15P-3FFVE1760E allows for the integration of a large number of gates and other digital logic elements, providing a high level of flexibility and customization.
  4. Advanced programmability: The IC is highly programmable, allowing it to be configured for a wide range of applications and use cases.
  5. Robust design: The XCKU15P-3FFVE1760E is designed to be robust and reliable, with features such as error-correcting code (ECC) memory and built-in self-test (BIST) capabilities.

Applications:

The XCKU15P-3FFVE1760E is suitable for use in a wide range of applications, including:

  1. Telecommunications: The IC can be used in telecommunications infrastructure, such as base stations and routers, to provide high-performance processing capabilities.
  2. Industrial automation: The IC can be used in industrial automation systems to provide real-time control and processing capabilities.
  3. Automotive: The IC can be used in automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems, to provide high-performance processing capabilities.
  4. Aerospace and defense: The IC can be used in aerospace and defense applications, such as radar systems and satellite communications, to provide high-performance processing capabilities.
  5. Data centers: The IC can be used in data centers to provide high-performance processing capabilities for data processing and analysis.

Overall, the XCKU15P-3FFVE1760E is a high-performance, low-power FPGA that offers a wide range of features and capabilities, making it suitable for use in a variety of applications.

FAQ

What package or case is XCKU15P-3FFVE1760E available in?
XCKU15P-3FFVE1760E is available in the 1760-BBGA, FCBGA package / case.
What is the mounting type of XCKU15P-3FFVE1760E?
What voltage specification is listed for XCKU15P-3FFVE1760E?
What operating temperature range does XCKU15P-3FFVE1760E support?
Are there related or alternative parts for XCKU15P-3FFVE1760E?
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