AMD

XCKU3P-L1SFVB784I  

FPGAs

AMD's XCKU3P-L1SFVB784I is a high-performance integrated circuit that is designed for use in a wide range of applications. This chip is manufactured by Advanced Micro Devices (AMD), a leading semiconductor company known for its innovative and reliable products.

Description:

The XCKU3P-L1SFVB784I is a programmable logic device that is based on the Xilinx Kintex UltraScale architecture. This chip features a high-density of programmable logic elements, making it ideal for use in complex and demanding applications. The XCKU3P-L1SFVB784I is available in a flip-chip ball grid array (FCBGA) package, which provides a high level of performance and reliability.

Features:

Some of the key features of the XCKU3P-L1SFVB784I include:

1. High-density programmable logic elements: The XCKU3P-L1SFVB784I features a high-density of programmable logic elements, making it ideal for use in complex and demanding applications.
2. Advanced I/O capabilities: The chip supports a wide range of I/O standards, including LVDS, DDR, and PCIe, making it suitable for use in a variety of applications.
3. High-performance memory: The XCKU3P-L1SFVB784I includes high-performance memory resources, such as block RAM and ultraRAM, which can be used to store and process large amounts of data.
4. Low power consumption: The chip is designed to operate at low power levels, making it suitable for use in energy-sensitive applications.
5. High-speed transceivers: The XCKU3P-L1SFVB784I includes high-speed transceivers that support data rates up to 28 Gbps, making it suitable for use in high-speed communication applications.

Applications:

The XCKU3P-L1SFVB784I is suitable for use in a wide range of applications, including:

1. High-performance computing: The chip's high-density of programmable logic elements and advanced memory resources make it ideal for use in high-performance computing applications, such as data centers and supercomputers.
2. Networking: The chip's advanced I/O capabilities and high-speed transceivers make it suitable for use in networking applications, such as routers and switches.
3. Automotive: The XCKU3P-L1SFVB784I can be used in automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems.
4. Industrial: The chip's low power consumption and high reliability make it suitable for use in industrial applications, such as motor control and robotics.
5. Aerospace and defense: The XCKU3P-L1SFVB784I can be used in aerospace and defense applications, such as satellite communication systems and radar systems.

Overall, the XCKU3P-L1SFVB784I is a high-performance integrated circuit that offers a wide range of features and capabilities. Its suitability for use in a variety of applications makes it a valuable component for engineers and designers working on complex and demanding projects.

XCKU3P-L1SFVB784I Documents

Download datasheets and manufacturer documentation for XCKU3P-L1SFVB784I

Datasheets :

Kintex UltraScale+ FPGAs Summary      

Environmental Information :

Xilinx REACH211 Cert       Xiliinx RoHS Cert