AMD's XCKU3P-L2SFVB784E is a high-performance integrated circuit (IC) designed for use in a variety of applications. This IC is manufactured by Advanced Micro Devices (AMD), a leading semiconductor company known for its innovative and reliable products.
Description:
The XCKU3P-L2SFVB784E is a field programmable gate array (FPGA) that offers a combination of high performance, low power consumption, and advanced features. It is based on the Xilinx Kintex UltraScale architecture, which is designed to provide exceptional performance and functionality for a wide range of applications.
Features:
High-performance processing: The XCKU3P-L2SFVB784E features a high-speed processing capability, making it suitable for applications that require fast and efficient data processing.
Low power consumption: This IC is designed to operate with low power consumption, making it an energy-efficient choice for various applications.
Advanced I/O capabilities: The XCKU3P-L2SFVB784E offers a wide range of input/output options, allowing for flexible connectivity with other components and systems.
On-chip memory: This FPGA comes with a substantial amount of on-chip memory, enabling efficient data storage and retrieval.
High-density logic integration: The XCKU3P-L2SFVB784E provides a high-density logic integration, allowing for complex designs and functionality to be implemented within a single IC.
Versatile configuration options: The FPGA can be programmed and reprogrammed, offering a high level of flexibility and adaptability for different applications.
Applications:
The XCKU3P-L2SFVB784E is suitable for a wide range of applications, including but not limited to:
Telecommunications: The high-speed processing and low power consumption make it ideal for use in telecommunications infrastructure, such as signal processing and network management.
Industrial automation: The FPGA's versatility and advanced I/O capabilities make it suitable for use in industrial automation systems, where precise control and data processing are required.
Military and aerospace: The XCKU3P-L2SFVB784E can be used in military and aerospace applications, where high reliability and performance are critical.
Medical equipment: This FPGA can be used in medical equipment, such as imaging systems and diagnostic devices, where high-speed data processing and low power consumption are essential.
Automotive: The XCKU3P-L2SFVB784E can be used in automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems, where high performance and reliability are crucial.
Data centers: The FPGA's high-performance processing and low power consumption make it suitable for use in data center applications, such as network management and data processing.
In summary, AMD's XCKU3P-L2SFVB784E is a high-performance FPGA that offers a combination of advanced features and versatility, making it suitable for a wide range of applications across various industries.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XCKU3P-L2SFVB784E Documents
Download datasheets and manufacturer documentation for XCKU3P-L2SFVB784E
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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