AMD

XCV1600E-6BG560C  

FPGAs

XCV1600E-6BG560C Description

The XCV1600E-6BG560C is an IC FPGA (Field-Programmable Gate Array) designed by AMD, featuring a robust set of technical specifications that make it suitable for a wide range of embedded applications. This FPGA is housed in a 560-ball BGA (Ball Grid Array) package, ensuring high-density integration and efficient surface mount technology (SMT) compatibility. It operates within a temperature range of 0°C to 85°C (TJ), making it suitable for industrial and commercial environments.

XCV1600E-6BG560C Features

• High Logic Capacity: The XCV1600E-6BG560C boasts 7776 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), providing a substantial amount of programmable logic resources. This high logic capacity allows for complex digital designs, making it ideal for applications requiring significant processing power and flexibility.
• Extensive I/O Capability: With 404 I/O pins, this FPGA offers extensive connectivity options, enabling it to interface with a wide variety of peripheral devices and systems. This makes it highly versatile for applications requiring multiple data inputs and outputs.
• Large RAM Capacity: The FPGA includes a total of 589,824 RAM bits, providing ample memory for storing data and instructions. This large RAM capacity enhances the performance of applications requiring high-speed data processing and storage.
• Low Power Consumption: Operating within a supply voltage range of 1.71V to 1.89V, the XCV1600E-6BG560C is designed for low power consumption, which is crucial for energy-efficient designs and battery-powered applications.
• Moisture Sensitivity Level (MSL) 3: The MSL rating of 3 (168 hours) ensures that the FPGA can withstand moderate levels of moisture exposure, making it suitable for environments with varying humidity levels.
• Compliance and Safety: The XCV1600E-6BG560C is REACH unaffected, ensuring compliance with environmental and safety regulations. It is also classified under ECCN 3A991D and HTSUS 8542.39.0001, facilitating international trade and regulatory compliance.

XCV1600E-6BG560C Applications

The XCV1600E-6BG560C is well-suited for a variety of applications due to its high logic capacity, extensive I/O, and large RAM capacity. Some specific use cases include:

• Telecommunications: Ideal for implementing complex signal processing algorithms and interfacing with various communication protocols, enhancing the performance of telecommunication systems.
• Industrial Automation: Suitable for controlling and monitoring industrial processes, where high I/O capability and low power consumption are critical.
• Medical Equipment: Can be used in medical imaging and diagnostic devices, where the need for high-speed data processing and reliability is paramount.
• Consumer Electronics: Enhances the functionality of consumer devices by providing a flexible platform for integrating multiple functionalities into a single chip.

Conclusion of XCV1600E-6BG560C

The XCV1600E-6BG560C is a powerful and versatile FPGA that offers significant advantages over similar models to due its high logic capacity, extensive I/O, and large RAM capacity. Its low power consumption and compliance with environmental and safety regulations make it an attractive choice for a wide range of applications. While the product is now obsolete, its legacy continues to influence the design and development of modern FPGAs. For existing systems that rely on this model, the XCV1600E-6BG560C remains a reliable and efficient solution.

XCV1600E-6BG560C Documents

Download datasheets and manufacturer documentation for XCV1600E-6BG560C

Datasheets :

Virtex-E 1.8V      

PCN Obsolescence/ EOL :

Spartan, Virtex, XC17V00 24/Apr/2013      

Environmental Information :

Xilinx REACH211 Cert       Xiliinx RoHS Cert