AMD_XCVC1502-2MSINSVG1369
AMD_XCVC1502-2MSINSVG1369
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AMD
XCVC1502-2MSINSVG1369

777-XCVC1502-2MSINSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
-40°C ~ 110°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
478
Peripherals
DDR, DMA, PCIe
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XCVC1502-2MSINSVG1369 Description

XCVC1502-2MSINSVG1369 Description

The XCVC1502-2MSINSVG1369 is a high-performance embedded IC chip from the Versal™ AI Core series, manufactured by AMD. This FPGA (Field-Programmable Gate Array) is designed to deliver exceptional processing capabilities and flexibility, making it suitable for a wide range of advanced applications. The device features a dual-speed architecture, supporting speeds of 600MHz and 1.4GHz, which allows for efficient handling of complex computational tasks. It integrates a powerful MPU (MicroProcessing Unit) and FPGA architecture, providing a versatile platform for both general-purpose processing and highly customized logic functions.

XCVC1502-2MSINSVG1369 Features

  • High-Speed Processing: The XCVC1502-2MSINSVG1369 supports dual-speed operations at 600MHz and 1.4GHz, ensuring robust performance for demanding applications.
  • Versatile Architecture: Combining an MPU with FPGA capabilities, this chip offers a flexible solution that can be tailored to specific needs through programmable logic.
  • Substantial RAM: Equipped with 256KB of RAM, this FPGA can handle significant data storage and processing tasks, enhancing its overall functionality.
  • Extensive I/O Connectivity: With 478 I/O pins, the XCVC1502-2MSINSVG1369 provides ample connectivity options, making it ideal for systems requiring multiple interfaces.
  • Advanced Peripherals: The chip includes support for DDR, DMA, and PCIe, enabling efficient data transfer and enhanced system performance.
  • Rich Connectivity Options: Features a comprehensive set of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Robust Packaging: Packaged in a tray format, the XCVC1502-2MSINSVG1369 ensures reliable handling and storage, reducing the risk of damage during transportation and assembly.
  • Environmental Compliance: The chip RO isHS3 compliant, ensuring it meets stringent environmental standards and is suitable for use in a wide range of industries.
  • Moisture Sensitivity Level: With an MSL rating of 4 (72 hours), the XCVC1502-2MSINSVG1369 is designed to withstand moderate moisture exposure, making it suitable for various manufacturing environments.

XCVC1502-2MSINSVG1369 Applications

The XCVC1502-2MSINSVG1369 is ideal for applications that demand high performance, flexibility, and extensive connectivity. Some specific use cases include:

  • Advanced Networking Solutions: The chip's high-speed processing capabilities and extensive connectivity options make it suitable for advanced networking equipment, such as routers and switches.
  • Automotive Systems: With its robust architecture and compliance with environmental standards, the XCVC1502-2MSINSVG1369 can be used in automotive systems, including advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI).
  • Industrial Automation: The extensive I/O and connectivity options make this FPGA ideal for industrial automation systems, where multiple sensors and actuators need to be integrated.
  • Medical Devices: The high-speed processing and compliance with environmental standards make the XCVC1502-2MSINSVG1369 suitable for medical imaging and diagnostic equipment.
  • Data Centers: The chip's ability to handle large amounts of data and its extensive connectivity options make it a strong candidate for use in data center infrastructure.

Conclusion of XCVC1520-2MSINSVG1369

The XCVC1502-2MSINSVG1369 from AMD's Versal™ AI Core series is a versatile and powerful FPGA that offers a wide range of technical specifications and performance benefits. Its dual-speed architecture, extensive I/O capabilities, and rich set of peripherals make it an ideal solution for a variety of high-performance applications. The chip's compliance with environmental standards and robust packaging further enhance its suitability for diverse industries. Whether used in advanced networking, automotive systems, industrial automation, medical devices, or data centers, the XCVC1502-2MSINSVG1369 provides a reliable and efficient platform for meeting the demands of modern electronics.

FAQ

What is XCVC1502-2MSINSVG1369?
XCVC1502-2MSINSVG1369 is a System On Chip (SoC) from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
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