AMD_XCVE1752-2MSENSVG1369
AMD_XCVE1752-2MSENSVG1369
original

AMD
XCVE1752-2MSENSVG1369

777-XCVE1752-2MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
0°C ~ 110°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
500
Peripherals
DDR, DMA, PCIe
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XCVE1752-2MSENSVG1369 Description

###VE XC1752-2MSENSVG1369 Description

The XCVE1752-2MSENSVG1369 is a high-performance Embedded IC Chip from AMD, part of the Versal™ AI Core series. This FPGA is designed to deliver exceptional performance and flexibility, making it ideal for a wide range of applications. The device features a dual-speed architecture, supporting both 600MHz and 1.4GHz operations, ensuring it can handle complex tasks efficiently. It operates within a temperature range of 0°C to 110°C (TJ), making it suitable for various environmental conditions.

The XCVE1752-2MSENSVG1369 is built with a robust architecture that includes both a Microprocessor Unit (MPU) and an FPGA, providing a versatile platform for both processing-intensive and logic-intensive tasks. It boasts 256KB of RAM, which is essential for managing data and executing tasks swiftly. The device also features 500 I/Os, offering extensive connectivity options, and supports a variety of peripherals, including DDR, DMA, and PCIe, enhancing its capability to interface with other systems.

XCVE1752-2MSENSVG1369 Features

  • Dual-Speed Architecture: The XCVE1752-2MSENSVG1369 supports dual-speed operations at 600MHz and 1.4GHz, providing flexibility to optimize performance and power consumption based on application requirements.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 110°C (TJ), the device is suitable for applications in diverse environments, from industrial to automotive.
  • Versatile Architecture: Combining an MPU and an FPGA, this device offers a balanced platform for both processing and logic tasks, making it highly adaptable for various applications.
  • Robust RAM and I/O: Equipped with 256KB of RAM and 500 I/Os, the XCVE1752-2MSENSVG1369 can handle substantial data processing and connectivity needs.
  • Rich Peripheral Support: The device supports a wide range of peripherals, including DDR, DMA, and PCIe, enhancing its capability to interface with other systems.
  • Advanced Connectivity Options: The XCVE1752-2MSENSVG1369 supports multiple connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile.
  • Moisture Sensitivity Level (MSL) 4: The device has a moisture sensitivity level of 4 (72 hours), ensuring reliability and longevity in various storage and operational conditions.
  • ROHS3 Compliant: The XCVE1752-2MSENSVG1369 is ROHS3 compliant, adhering to stringent environmental standards and ensuring it is safe for use in environmentally conscious applications.

XCVE1752-2MSENSVG1369 Applications

The XCVE1752-2MSENSVG1369 is ideal for applications requiring high performance, flexibility, and reliability. Its dual-speed architecture and versatile connectivity options make it suitable for a variety of industries, including:

  • Industrial Automation: The device's robust architecture and wide operating temperature range make it ideal for industrial applications where reliability and performance are critical.
  • Automotive: The XCVE1752-2MSENSVG1369's ability to operate in a wide temperature range and its advanced connectivity options make it suitable for automotive applications, including advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI).
  • Communication Infrastructure: The device's support for multiple connectivity options and peripherals makes it well-suited for communication infrastructure applications, such as 5G base stations and data centers.
  • Medical Devices: The XCVE1752-2MSENSVG1369's high performance and reliability make it suitable for medical devices that require precise control and data processing, such as diagnostic equipment and patient monitoring systems.

Conclusion of XCVE1752-2MSENSVG1369

The XCVE1752-2MSENSVG1369 is a versatile and high-performance Embedded IC Chip from AMD, offering a unique combination of MPU and FPGA capabilities. Its dual-speed architecture, wide operating temperature range, and extensive connectivity options make it suitable for a wide range of applications. The device's robust RAM and I/O capabilities, along with its support for multiple peripherals, further enhance its versatility. The XCVE1752-2MSENSVG1369 is an excellent choice for applications in industrial automation, automotive, communication infrastructure, and medical devices, where performance, flexibility, and reliability are paramount.

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