AMD_XCVM1502-2LLEVFVC1760
AMD_XCVM1502-2LLEVFVC1760
original

AMD
XCVM1502-2LLEVFVC1760

777-XCVM1502-2LLEVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
450MHz, 1.08GHz
Operating Temperature
0°C ~ 110°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
500
Peripherals
DDR, DMA, PCIe
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XCVM1502-2LLEVFVC1760 Description

XCVM1502-2LLEVFVC1760 Description

The XCVM1502-2LLEVFVC1760 is an advanced Embedded IC Chip from AMD's Versal™ Prime series, designed to deliver exceptional performance and versatility for a wide range of applications. This FPGA (Field-Programmable Gate Array) is equipped with a dual-core architecture combining a 450MHz and a 1.08GHz processing speed, ensuring robust computational capabilities. It operates within a temperature range of 0°C to 110°C (TJ), making it suitable for demanding industrial environments. The XCVM1502-2LLEVFVC1760 features 256KB of RAM and 500 I/Os, providing ample memory and connectivity options. It supports a variety of peripherals, including DDR, DMA and, PCIe, enhancing its functionality and integration capabilities.

XCVM1502-2LLEVFVC1760 Features

The XCVM1502-2LLEVFVC1760 stands out with its unique combination features of and performance benefits:

  • Dual-Core Architecture: The MPU and FPGA cores offer a balanced blend of processing power and programmability, ideal for complex tasks requiring both high-speed computation and customizable logic.
  • Memory and I/O: With 256KB of RAM and 500 I/Os, this FPGA can handle large data sets and extensive connectivity requirements, making it suitable for applications with high I/O demands.
  • Peripheral Support: The inclusion of DDR, DMA, and PCIe peripherals ensures seamless integration with other system components, facilitating efficient data transfer and system management.
  • Connectivity Options: The XCVM1502-2LLEVFVC1760 supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various embedded systems.
  • Packaging and Compliance: The device is packaged in a tray format and is RoHS3 compliant, ensuring environmental sustainability and regulatory adherence.
  • Moisture Sensitivity Level: With an MSL of 4 (72 Hours), the XCVM1502-2LLEVFVC1760 is designed to withstand moisture, making it suitable for environments with varying humidity levels.

XCVM1502-2LLEVFVC1760 Applications

The XCVM1502-2LLEVFVC1760 is ideal for a variety of applications due to its robust performance and versatile features:

  • Industrial Automation: Its high I/O count and connectivity options make it perfect controlling for and monitoring industrial processes, ensuring efficient and reliable operations.
  • Telecommunications: The support for Ethernet and other communication protocols enables the development of advanced communication systems, including base stations and network switches.
  • Automotive Systems: The device's ability to handle high-speed data and processing its wide temperature range make it suitable for automotive applications, such as advanced driver-assistance systems (ADAS) and infotainment systems.
  • Medical Devices: The XCVM1502-2LLEVFVC1760 can be used in medical imaging and diagnostic equipment, where high computational power and low latency are critical.
  • Aerospace and Defense: Its rugged design and high performance make it suitable for aerospace and defense applications, including avion andics radar systems.

Conclusion of XCVM1502-2LLEVFVC1760

The XCVM1502-2LLEVFVC1760 is a powerful and versatile FPGA from AMD's Versal™ Prime series, offering a unique blend of high-speed processing, extensive memory, and robust connectivity options. Its dual-core architecture and wide range of peripherals make it an excellent choice for applications requiring both computational power and customizable logic. device The's compliance with RoHS3 standards and its ability to withstand varying environmental conditions further enhance its appeal. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or aerospace and defense, the XCVM1502-2LLEVFVC1760 provides a reliable and efficient solution for demanding embedded applications.

FAQ

What package or case is XCVM1502-2LLEVFVC1760 available in?
XCVM1502-2LLEVFVC1760 is available in the 1760-BFBGA, FCBGA package / case.
What operating temperature range does XCVM1502-2LLEVFVC1760 support?
What is the mounting type of XCVM1502-2LLEVFVC1760?
What voltage specification is listed for XCVM1502-2LLEVFVC1760?
Is XCVM1502-2LLEVFVC1760 currently in stock?
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