AMD_XCVM1502-2LSENFVB1369
AMD_XCVM1502-2LSENFVB1369
original

AMD
XCVM1502-2LSENFVB1369

777-XCVM1502-2LSENFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
450MHz, 1.08GHz
Operating Temperature
0°C ~ 110°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
478
Peripherals
DDR, DMA, PCIe
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XCVM1502-2LSENFVB1369 Description

XCVM1502-2LSENFVB1369 Description

The XCVM1502-2LSENFVB1369 is a high-performance System on Chip (SoC) from AMD's Versal™ Prime series, designed to deliver exceptional processing capabilities and flexibility. This IC integrates a powerful MPU and FPGA architecture, offering a versatile platform for a wide range of applications. With a clock speed of 450MHz and 1.08GHz, it ensures rapid data processing and efficient handling of complex tasks. The device operates within a temperature range of 0°C to 110°C (TJ), making it suitable for demanding industrial environments. It features 256KB of RAM, 478 I/Os, and a comprehensive set of peripherals including DDR, DMA, and PCIe, which enhance its connectivity and data management capabilities. The XCVM1502-2LSENFVB1369 is packaged in a 1369 BGA format and is RoHS3 compliant, ensuring environmental sustainability. It also has a moisture sensitivity level (MSL) of 4 (72 hours), making it robust against moisture-related issues.

XCVM1502-2LSENFVB1369 Features

  • High-Speed Processing: The XCVM1502-2LSENFVB1369 boasts a dual-speed capability of 450MHz and 1.08GHz, enabling it to handle high-speed data processing and complex computations with ease.
  • Robust Architecture: Combining an MPU and FPGA architecture, this SoC offers the flexibility to adapt to various processing requirements, making it ideal for applications that demand both general-purpose processing and specialized hardware acceleration.
  • Extensive Connectivity: Equipped with a wide array of peripherals such as DDR, DMA, PCIe, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, the XCVM1502-2LSENFVB1369 can seamlessly integrate with various external devices and systems.
  • Large I/O Capacity: With 478 I/Os, this SoC can manage multiple input and output operations simultaneously, enhancing its capability to interface with a wide range of sensors, actuators, and other peripherals.
  • Substantial RAM: The 256KB of RAM ensures efficient data storage and retrieval, facilitating smooth operation even under heavy computational loads.
  • Wide Operating Temperature Range: The ability to operate between 0°C and 110°C (TJ) makes this SoC suitable for applications in harsh environments, such as industrial automation and automotive systems.
  • Environmental Compliance: Being RoHS3 compliant, the XCVM1502-2LSENFVB1369 adheres to stringent environmental standards, ensuring minimal environmental impact.
  • Moisture Resistance: With an MSL of 4 (72 hours), this SoC is well-protected against moisture, enhancing its reliability and longevity in humid conditions.

XCVM1502-2LSENFVB1369 Applications

The XCVM1502-2LSENFVB1369 is ideally suited for applications that require high computational power, extensive connectivity, and robust environmental resilience. Its versatile architecture and comprehensive feature set make it a preferred choice for:

  • Industrial Automation: Managing complex control systems, interfacing with numerous sensors and actuators, and ensuring reliable operation in harsh industrial environments.
  • Automotive Systems: Supporting advanced driver assistance systems (ADAS), infotainment systems, and other automotive electronics that demand high performance and reliability.
  • Telecommunications: Facilitating high-speed data processing and communication in base stations, routers, and other telecom equipment.
  • Medical Devices: Enabling real-time data processing and control in medical imaging, diagnostic equipment, and other medical devices that require precision and reliability.
  • Consumer Electronics: Enhancing the performance of smart home devices, gaming consoles, and other consumer electronics by providing powerful processing capabilities and extensive connectivity options.

Conclusion of XCVM1502-2LSENFVB1369

The XCVM1502-2LSENFVB1369 from AMD's Versal™ Prime series stands out as a highly capable and versatile System on Chip (SoC). Its combination of high-speed processing, robust architecture, extensive connectivity, and environmental resilience makes it an excellent choice for a wide range of demanding applications. Whether used in industrial automation, automotive systems, telecommunications, medical devices, or consumer electronics, this SoC delivers superior performance and reliability. Its unique features and advantages over similar models ensure that it remains a top choice for engineers and designers seeking a powerful and flexible solution for their next-generation projects.

FAQ

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The standard lead time for XCVM1502-2LSENFVB1369 is 16 Weeks.
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