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XCZU17EG-2FFVC1760E

XCZU17EG-2FFVC1760E Description

The XCZU17EG-2FFVC1760E from AMD's Zynq® UltraScale+™ MPSoC EG series is a high-performance System-on-Chip (SoC) integrating a quad-core ARM® Cortex®-A53 processor (up to 1.3GHz), dual-core Cortex-R5 real-time processors, and a UltraScale+™ FPGA fabric with 926K+ logic cells. Designed for demanding embedded applications, it operates within a 0°C to 100°C (TJ) temperature range and features 512 I/Os, 256KB RAM, and advanced peripherals like CANbus, Ethernet, USB OTG, and multiple serial interfaces. Packaged in a 1760-pin FCBGA, it is ROHS3 compliant and adheres to REACH standards, making it suitable for industrial and automotive environments.

XCZU17EG-2FFVC1760E Features

• Heterogeneous Processing: Combines FPGA programmability with ARM Cortex-A53/R5 cores for flexible, high-speed processing.
• High-Speed Connectivity: Supports Ethernet, USB OTG, CANbus, SPI, I2C, and UART/USART for seamless system integration.
• Robust Memory & I/O: 256KB RAM and 512 configurable I/Os enable complex real-time applications.
• Industrial-Grade Reliability: Extended temperature range (0°C–100°C) and MSL 4 (72-hour moisture resistance) ensure durability.
• Low-Power Efficiency: Optimized for power-sensitive designs while delivering 533MHz–1.3GHz performance scalability.

XCZU17EG-2FFVC1760E Applications

• Automotive: Advanced driver-assistance systems (ADAS), in-vehicle networking.
• Industrial Automation: Machine vision, robotics, and PLCs requiring real-time control.
• Aerospace & Defense: Radar, secure communications, and avionics processing.
• Medical Imaging: High-throughput data acquisition and processing.
• 5G & Wireless Infrastructure: Baseband processing and edge computing.

Conclusion of XCZU17EG-2FFVC1760E

The XCZU17EG-2FFVC1760E stands out for its dual ARM-FPGA architecture, high I/O count, and industrial resilience, making it ideal for compute-intensive, real-time embedded systems. Its versatile connectivity and UltraScale+™ FPGA fabric provide unmatched flexibility for automotive, industrial, and communications applications, outperforming conventional SoCs in scalability and integration.