AMD_XCZU6EG-L1FFVC900I
original

AMD
XCZU6EG-L1FFVC900I

777-XCZU6EG-L1FFVC900I
IC SOC CORTEX-A53 900FCBGA
16 Weeks

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ISO9001
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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
500MHz, 600MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
204
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XCZU6EG-L1FFVC900I Description

XCZU6EG-L1FFVC900I Description

The XCZU6EG-L1FFVC900I is a high-performance Embedded IC Chip from AMD, part of the Zynq® UltraScale+™ MPSoC EG series. This IC is designed to deliver exceptional processing capabilities and flexibility, making it ideal for a wide range of embedded applications. The device features a dual-core ARM Cortex-A53 processor, combined with a powerful FPGA fabric that includes over 469K logic cells. This integration of an MCU and FPGA architecture allows for both high-speed processing and customizable hardware acceleration.

XCZU6EG-L1FFVC900I Features

  • Speed: The XCZU6EG-L1FFVC900I operates at speeds of 500MHz, 600MHz, and 1.2GHz, providing robust performance for demanding applications.
  • Architecture: Combines a multi-core MCU with an FPGA, offering both programmable logic and high-performance processing.
  • RAM Size: Equipped with 256KB of RAM, ensuring efficient data handling and processing.
  • ECCN: Classified under ECCN 5A002A4 XIL, indicating its compliance with international export regulations.
  • Number of I/O: Features 204 I/O pins, providing extensive connectivity options.
  • Peripherals: Includes DMA (Direct Memory Access) and WDT (Watchdog Timer) for enhanced functionality.
  • Connectivity: Supports a wide range of communication protocols, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Package: Supplied in a Tray package, suitable for high-volume manufacturing processes.
  • Moisture Sensitivity Level (MSL): Rated at MSL 4 (72 Hours), ensuring reliability in various environmental conditions.
  • RoHS Status: Compliant with ROHS3, ensuring environmental safety and regulatory adherence.
  • Primary Attributes: The device boasts over 469K logic cells in its FPGA fabric, providing extensive programmability and customization.

XCZU6EG-L1FFVC900I Applications

The XCZU6EG-L1FFVC900I is well-suited for a variety of applications due to its versatile architecture and high performance. Key applications include:

  • Industrial Automation: The combination of high-speed processing and programmable logic makes it ideal for real-time control systems and complex automation tasks.
  • Communication Systems: Its extensive connectivity options and high-speed processing capabilities make it suitable for network infrastructure, including routers and switches.
  • Medical Devices: The device's reliability and performance are crucial for medical imaging and diagnostic equipment.
  • Automotive Systems: The XCZU6EG-L1FFVC900I can be used in advanced driver assistance systems (ADAS) and infotainment systems, leveraging its high-speed processing and connectivity features.
  • Consumer Electronics: Ideal for high-performance devices such as smart TVs, gaming consoles, and other consumer electronics requiring advanced processing and connectivity.

Conclusion of XCZU6EG-L1FFVC900I

The XCZU6EG-L1FFVC900I is a versatile and powerful Embedded IC Chip that stands out in the electronics industry due to its unique combination of MCU and FPGA capabilities. Its high-speed processing, extensive connectivity options, and customizable logic cells make it an excellent choice for a wide range of applications. The device's compliance with international regulations and environmental standards further enhances its appeal. Whether used in industrial automation, communication systems, or consumer electronics, the XCZU6EG-L1FFVC900I delivers reliable performance and advanced functionality, making it a top choice for engineers and designers seeking a high-performance embedded solution.

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