AMD_XCZU43DR-1FFVE1156I
original

AMD
XCZU43DR-1FFVE1156I

777-XCZU43DR-1FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
500MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DDR, DMA, PCIe
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XCZU43DR-1FFVE1156I Description

XCZU43DR-1FFVE1156I Description

The XCZU43DR-1FFVE1156I is a high-performance Embedded IC Chip from AMD, belonging to the esteemed Zynq® UltraScale+™ RFSoC series. This advanced IC integrates a powerful 1.2GHz MCU with a robust FPGA architecture, offering a versatile platform for a wide range of applications. It features a substantial 256KB of RAM and an impressive 930K+ logic cells, ensuring ample processing power and flexibility. The device is housed in a 1156-ball BGA package, making it suitable for high-density, space-constrained designs. With a speed range of 500MHz to 1.2GHz, the XCZU43DR-1FFVE1156I delivers exceptional performance, making it ideal for demanding embedded systems.

XCZU43DR-1FFVE1156I Features

  • Dual-Core Architecture: Combines a 1.2GHz MCU with a high-capacity FPGA, providing a balanced blend of processing power and programmability.
  • Extensive RAM and Logic Cells: Equipped with 256KB of RAM and over 930K logic cells, ensuring ample memory and computational resources.
  • Rich Peripheral Set: Includes DDR, DMA, PCIe, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, supporting diverse connectivity needs.
  • High I/O Count: Features 366 I/O pins, enabling extensive connectivity and interfacing options.
  • Advanced Packaging: Utilizes a 1156-ball BGA package, optimized for high-density applications.
  • Moisture Sensitivity Level: MSL 4 (72 Hours), ensuring reliability in various environmental conditions.
  • Compliance: ROHS3 Compliant, meeting stringent environmental and safety standards.
  • Active Product Status: Ensures long-term availability and support from the manufacturer.

XCZU43DR-1FFVE1156I Applications

The XCZU43DR-1FFVE1156I is ideal for a variety of high-performance embedded applications, including but not limited to:

  • Telecommunications: Ideal for base stations, signal processing, and network infrastructure due to its high-speed processing and extensive connectivity options.
  • Aerospace and Defense: Suitable for avionics, radar systems, and other mission-critical applications requiring high reliability and performance.
  • Industrial Automation: Perfect for programmable logic controllers (PLCs), industrial IoT gateways, and robotic systems, leveraging its robust architecture and extensive I/O capabilities.
  • Medical Devices: Applicable in diagnostic equipment, imaging systems, and patient monitoring devices, benefiting from its high-speed processing and low power consumption.
  • Automotive: Suitable for advanced driver assistance systems (ADAS), infotainment systems, and vehicle control units, thanks to its high performance and reliability.

Conclusion of XCZU43DR-1FFVE1156I

The XCZU43DR-1FFVE1156I stands out as a versatile and high-performance solution within the Zynq® UltraScale+™ RFSoC series. Its combination of a powerful MCU and FPGA, extensive RAM, and rich peripheral set make it a compelling choice for a wide range of demanding applications. With its high I/O count, advanced packaging, and compliance with stringent environmental standards, the XCZU43DR-1FFVE1156I offers significant advantages over similar models. Whether deployed in telecommunications, aerospace, industrial automation, medical devices, or automotive systems, this IC delivers exceptional performance and reliability, making it a preferred choice for engineers and designers in the electronics industry.

FAQ

What operating temperature range does XCZU43DR-1FFVE1156I support?
XCZU43DR-1FFVE1156I has an operating temperature range of -40°C ~ 100°C (TJ).
What is XCZU43DR-1FFVE1156I?
What package or case is XCZU43DR-1FFVE1156I available in?
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