AMD_XCZU47DR-2FSVE1156E
original

AMD
XCZU47DR-2FSVE1156E

777-XCZU47DR-2FSVE1156E
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.333GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DMA, WDT
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XCZU47DR-2FSVE1156E Description

XCZU47DR-2FSVE1156E Description

The XCZU47DR-2FSVE1156E is a high-performance System on Chip (SoC) from AMD, part of the Zynq® UltraScale+™ RFSoC series. This IC integrates advanced processing capabilities with extensive connectivity options, making it ideal for demanding applications requiring high-speed processing and robust communication interfaces. The device features a dual-core ARM Cortex-A53 processor, combined with a powerful FPGA fabric, offering over 930K logic cells for customizable hardware acceleration. It supports a wide range of peripherals, including DMA, WDT, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless integration into complex systems.

XCZU47DR-2FSVE1156E Features

  • High-Speed Processing: The XCZU47DR-2FSVE1156E operates at speeds up to 533MHz and 1.333GHz, providing exceptional performance for real-time and high-throughput applications.
  • Flexible Architecture: Combining an MCU with an FPGA, this SoC offers the best of both worlds—programmable logic for custom hardware acceleration and a microcontroller for traditional processing tasks.
  • Robust Memory and I/O: With 256KB of RAM and 366 I/O pins, the XCZU47DR-2FSVE1156E can handle complex data processing and communication tasks efficiently.
  • Wide Operating Temperature Range: Suitable for industrial and automotive applications, the XCZU47DR-2FSVE1156E operates reliably within a temperature range of 0°C to 100°C (TJ).
  • Advanced Connectivity: The device supports a comprehensive set of communication protocols, including CANbus, Ethernet, I2C, SPI, and USB OTG, facilitating integration into diverse systems.
  • Compliance and Packaging: The XCZU47DR-2FSVE1156E is ROHS3 compliant and comes in a Tray package, ensuring environmental sustainability and ease of handling during manufacturing.
  • Moisture Sensitivity Level: With an MSL rating of 4 (72 Hours), the device is well-suited for environments with varying humidity levels, ensuring reliability and longevity.

XCZU47DR-2FSVE1156E Applications

The XCZU47DR-2FSVE1156E is ideal for a variety of applications across multiple industries:

  • Industrial Automation: Its robust processing capabilities and extensive connectivity options make it suitable for controlling complex machinery and systems.
  • Automotive: The wide operating temperature range and high reliability ensure it can withstand the demanding conditions of automotive applications.
  • Telecommunications: The high-speed processing and advanced connectivity features support the development of next-generation communication systems.
  • Medical Devices: The device's performance and reliability make it ideal for critical medical equipment requiring precise control and data processing.
  • Consumer Electronics: The XCZU47DR-2FSVE1156E can be used in high-end consumer devices, providing advanced processing and connectivity features.

Conclusion of XCZU47DR-2FSVE1156E

The XCZU47DR-2FSVE1156E stands out as a versatile and powerful SoC, offering a unique blend of high-performance processing, extensive connectivity, and robust reliability. Its dual-core ARM Cortex-A53 processor and FPGA fabric provide unparalleled flexibility, allowing developers to optimize both hardware and software components for their specific applications. With its wide operating temperature range, compliance with industry standards, and comprehensive set of peripherals, the XCZU47DR-2FSVE1156E is well-suited for a broad range of applications, from industrial automation to automotive systems. This makes it an ideal choice for engineers and designers seeking a reliable, high-performance solution for their next-generation projects.

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