AMD_XCZU43DR-1FSVE1156I
original

AMD
XCZU43DR-1FSVE1156I

777-XCZU43DR-1FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
500MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DDR, DMA, PCIe
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XCZU43DR-1FSVE1156I Description

XCZU43DR-1FSVE1156I Description

The XCZU43DR-1FSVE1156I is a high-performance embedded IC chip from the Zynq® UltraScale+™ RFSoC series, manufactured by AMD. This advanced IC integrates a powerful MCU and FPGA architecture, offering a versatile solution for a wide range of applications. With a clock speed of up to 1.2GHz and 930K+ logic cells, it delivers exceptional processing capabilities. The device features 256KB of RAM and supports 366 I/Os, providing ample memory and connectivity options. It also includes essential peripherals such as DDR, DMA, and PCIe, enhancing its functionality and integration potential.

XCZU43DR-1FSVE1156I Features

  • High-Speed Performance: The XCZU43DR-1FSVE1156I operates at speeds of 500MHz and 1.2GHz, making it suitable for demanding applications requiring rapid data processing and real-time performance.
  • Advanced Architecture: Combining an MCU and FPGA, this IC offers the flexibility to handle both general-purpose computing tasks and highly customized, parallel processing workflows.
  • Robust Memory and I/O: With 256KB of RAM and 366 I/Os, it provides sufficient memory and connectivity for complex systems, ensuring efficient data handling and communication.
  • Comprehensive Peripherals: The inclusion of DDR, DMA, and PCIe peripherals enhances its capability to manage high-speed data transfers and interface with various external devices.
  • Versatile Connectivity: The XCZU43DR-1FSVE1156I supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for different system requirements.
  • Packaging and Compliance: Available in a tray package and RoHS3 compliant, it meets environmental and manufacturing standards, ensuring reliability and sustainability.
  • Moisture Sensitivity Level: With an MSL of 4 (72 Hours), it is designed to withstand typical manufacturing conditions, reducing the risk of moisture-related damage.

XCZU43DR-1FSVE1156I Applications

The XCZU43DR-1FSVE1156I is ideal for applications that require high performance, flexibility, and extensive connectivity. Its unique features make it suitable for:

  • Telecommunications: Ideal for 5G infrastructure, where high-speed data processing and low latency are critical.
  • Industrial Automation: Perfect for controlling complex systems with real-time requirements, such as robotics and industrial IoT.
  • Medical Devices: Suitable for advanced medical imaging and diagnostic equipment, where precision and reliability are paramount.
  • Automotive: Can be used in advanced driver-assistance systems (ADAS) and autonomous vehicles, providing the necessary processing power and connectivity.
  • Aerospace and Defense: Ideal for mission-critical systems that require high performance and reliability under stringent environmental conditions.

Conclusion of XCZU43DR-1FSVE1156I

The XCZU43DR-1FSVE1156I stands out as a versatile and high-performance embedded IC chip, offering a unique blend of MCU and FPGA capabilities. Its robust architecture, extensive connectivity options, and compliance with industry standards make it a reliable choice for a variety of demanding applications. Whether in telecommunications, industrial automation, or advanced medical devices, the XCZU43DR-1FSVE1156I provides the necessary performance and flexibility to meet the needs of modern electronics systems.

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