AMD_XCZU43DR-2FSVG1517E
original

AMD
XCZU43DR-2FSVG1517E

777-XCZU43DR-2FSVG1517E
IC ZUP RFSOC A53 FPGA 1517BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.333GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
561
Peripherals
DDR, DMA, PCIe
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XCZU43DR-2FSVG1517E Description

XCZU43DR-2FSVG1517E Description

The XCZU43DR-2FSVG1517E is a high-performance System on Chip (SoC) from AMD's Zynq® UltraScale+™ RFSoC series. This IC integrates an advanced FPGA fabric with a powerful ARM Cortex-A53 processor, making it ideal for applications requiring both high computational power and flexible programmability. The device is housed in a 1517 BGA package and is designed to operate within a temperature range of 0°C to 100°C (TJ). It is RoHS3 compliant and has a moisture sensitivity level (MSL) of 4, ensuring reliability in various environmental conditions.

XCZU43DR-2FSVG1517E Features

  • Architecture: The XCZU43DR-2FSVG1517E features a dual-architecture design combining a high-performance ARM Cortex-A53 MCU with a robust FPGA fabric. This integration allows for seamless data processing and real-time control.
  • Speed: The SoC operates at speeds of up to 533MHz and 1.333GHz, providing exceptional performance for demanding applications.
  • RAM Size: Equipped with 256KB of RAM, this SoC can handle complex tasks and store critical data efficiently.
  • I/O Capabilities: With 561 I/Os, the XCZU43DR-2FSVG1517E offers extensive connectivity options, making it suitable for a wide range of applications.
  • Peripherals: The SoC supports various peripherals including DDR, DMA, and PCIe, enhancing its versatility and integration capabilities.
  • Connectivity: The XCZU43DR-2FSVG1517E provides comprehensive connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless communication with other devices.
  • Logic Cells: With over 930K logic cells, the FPGA fabric offers extensive programmability and customization options.
  • Package: The device is available in a Tray package, ensuring ease of handling and integration into various systems.

XCZU43DR-2FSVG1517E Applications

The XCZU43DR-2FSVG1517E is well-suited for a variety of high-performance applications, including:

  • Wireless Communication Systems: The combination of ARM Cortex-A53 and FPGA fabric makes it ideal for baseband processing and signal handling in wireless communication systems.
  • Data Centers: The device's high-speed processing capabilities and extensive I/O options make it suitable for data center applications, including data processing and storage.
  • Industrial Automation: The XCZU43DR-2FSVG1517E can be used in industrial automation for real-time control and monitoring, leveraging its robust FPGA and ARM processor.
  • Medical Imaging: The SoC's high computational power and programmability make it suitable for medical imaging applications, where real-time processing and data handling are critical.
  • Aerospace and Defense: The device's reliability and high performance make it ideal for aerospace and defense applications, where stringent performance and environmental requirements are common.

Conclusion of XCZU43DR-2FSVG1517E

The XCZU43DR-2FSVG1517E is a versatile and powerful SoC designed to meet the demands of high-performance applications. Its unique combination of ARM Cortex-A53 and FPGA fabric, along with extensive connectivity options and robust I/O capabilities, sets it apart from similar models. The device's RoHS3 compliance and MSL 4 rating ensure reliability and environmental sustainability. Whether used in wireless communication, data centers, industrial automation, medical imaging, or aerospace and defense, the XCZU43DR-2FSVG1517E offers exceptional performance and flexibility, making it a valuable component for modern electronic systems.

FAQ

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