AMD_XCZU46DR-1FSVH1760E
original

AMD
XCZU46DR-1FSVH1760E

777-XCZU46DR-1FSVH1760E
IC ZUP RFSOC A53 FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
500MHz, 1.2GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
574
Peripherals
DDR, DMA, PCIe
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XCZU46DR-1FSVH1760E Description

XCZU46DR-1FSVH1760E Description

The XCZU46DR-1FSVH1760E is an advanced Embedded IC Chip from the Zynq® UltraScale+™ RFSoC series, manufactured by AMD. This IC is designed to deliver high performance and versatility, making it suitable for a wide range of applications. It features a dual-core ARM Cortex-A53 processor, integrated with a powerful FPGA fabric, providing a seamless blend of processing and programmable logic capabilities. The device operates within a temperature range of 0°C to 100°C (TJ) and is housed in a 1760 BGA package, ensuring robustness and reliability in various operating conditions.

XCZU46DR-1FSVH1760E Features

  • High-Speed Performance: The XCZU46DR-1FSVH1760E offers dual-core processing speeds of up to 1.2GHz, complemented by a 500MHz FPGA fabric, enabling efficient handling of complex computational tasks and real-time processing.
  • Memory and Storage: Equipped with 256KB of on-chip RAM, this IC provides ample memory for storing critical data and instructions, ensuring smooth operation and quick access.
  • I/O Capabilities: With 574 I/Os, the XCZU46DR-1FSVH1760E supports a wide array of peripherals, including DDR, DMA, and PCIe, facilitating extensive connectivity options and high-speed data transfer.
  • Connectivity: The device supports multiple communication protocols such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for various embedded systems.
  • Compliance and Packaging: The XCZU46DR-1FSVH1760E is ROHS3 compliant, ensuring environmental sustainability. It is packaged in a Tray format, suitable for automated assembly processes.
  • Moisture Sensitivity: With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), the IC is designed to withstand moderate levels of humidity, enhancing its reliability in diverse environments.

XCZU46DR-1FSVH1760E Applications

The XCZU46DR-1FSVH1760E is ideal for applications requiring high computational power and extensive connectivity options. Its unique features make it suitable for:

  • Communication Systems: The support for multiple communication protocols and high-speed I/Os makes it perfect for implementing advanced communication systems, including 5G infrastructure and IoT gateways.
  • Industrial Automation: The robustness and extensive connectivity options enable the development of sophisticated industrial control systems, capable of handling complex tasks and interfacing with various sensors and actuators.
  • Medical Devices: The high performance and reliability of the XCZU46DR-1FSVH1760E make it suitable for medical imaging and diagnostic equipment, where precision and real-time processing are critical.
  • Automotive Electronics: The device's ability to handle high-speed data transfer and its compliance with stringent environmental standards make it ideal for automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems.

Conclusion of XCZU46DR-1FSVH1760E

The XCZU46DR-1FSVH1760E stands out as a versatile and powerful Embedded IC Chip, offering a unique blend of high-speed processing capabilities and extensive connectivity options. Its robust design and compliance with industry standards make it a reliable choice for a wide range of applications, from communication systems to industrial automation and medical devices. The XCZU46DR-1FSVH1760E is an excellent choice for engineers and designers looking to integrate advanced processing and programmable logic capabilities into their embedded systems.

FAQ

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The standard lead time for XCZU46DR-1FSVH1760E is 16 Weeks.
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