AMD_XCZU47DR-1FSVE1156I
original

AMD
XCZU47DR-1FSVE1156I

777-XCZU47DR-1FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
500MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DMA, WDT
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XCZU47DR-1FSVE1156I Description

XCZU47DR-1FSVE1156I Description

The XCZU47DR-1FSVE1156I is a high-performance System on Chip (SoC) from AMD, featuring the Zynq® UltraScale+™ RFSoC architecture. This IC integrates a powerful 1.2GHz multi-core processor with a robust FPGA fabric, offering a versatile platform for complex embedded systems. It supports a wide range of connectivity options, including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for various industrial and communication applications. The device comes in a 1156-ball BGA package and is RoHS3 compliant, ensuring environmental sustainability. With a moisture sensitivity level (MSL) of 4 (72 hours), it is designed for reliable performance in diverse operating conditions.

XCZU47DR-1FSVE1156I Features

  • High-Speed Performance: The XCZU47DR-1FSVE1156I operates at speeds up to 1.2GHz, providing rapid processing capabilities for demanding applications.
  • Advanced Architecture: Combines a multi-core MCU with a high-density FPGA, offering over 930K logic cells for extensive programmability.
  • Robust Memory: Equipped with 256KB of RAM, ensuring efficient data handling and storage.
  • Extensive Connectivity: Supports a variety of interfaces such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into complex systems.
  • Peripheral Integration: Includes DMA and WDT peripherals for enhanced functionality and reliability.
  • High I/O Capacity: Features 366 I/O pins, providing ample connectivity options for peripheral devices.
  • Compliance and Reliability: RoHS3 compliant and rated at MSL 4 (72 hours), ensuring environmental sustainability and reliability in various operating conditions.
  • Packaging: Supplied in a tray package, suitable for automated assembly processes.

XCZU47DR-1FSVE1156I Applications

The XCZU47DR-1FSVE1156I is ideal for applications requiring high computational power and extensive connectivity. Its advanced architecture and robust features make it suitable for:

  • Telecommunications: Ideal for base stations, wireless communication systems, and network infrastructure.
  • Industrial Automation: Perfect for programmable logic controllers (PLCs), robotics, and industrial IoT applications.
  • Automotive: Suitable for advanced driver assistance systems (ADAS), vehicle networking, and in-vehicle infotainment systems.
  • Medical Devices: Can be used in medical imaging, diagnostic equipment, and patient monitoring systems.
  • Military and Aerospace: Ideal for radar systems, satellite communication, and avionics.

Conclusion of XCZU47DR-1FSVE1156I

The XCZU47DR-1FSVE1156I stands out as a versatile and powerful SoC, offering a unique blend of high-speed processing, extensive connectivity, and robust programmability. Its advanced architecture and wide range of features make it a superior choice over similar models, providing significant advantages in performance and reliability. Whether deployed in telecommunications, industrial automation, or automotive applications, the XCZU47DR-1FSVE1156I delivers exceptional performance and functionality, making it an ideal solution for modern embedded systems.

FAQ

What package or case is XCZU47DR-1FSVE1156I available in?
XCZU47DR-1FSVE1156I is available in the 1156-BBGA, FCBGA package / case.
What operating temperature range does XCZU47DR-1FSVE1156I support?
What is the standard lead time for XCZU47DR-1FSVE1156I?
Is XCZU47DR-1FSVE1156I currently in stock?
Does XCZU47DR-1FSVE1156I have quantity-based pricing?
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