AMD_XCZU48DR-2FFVE1156I
original

AMD
XCZU48DR-2FFVE1156I

777-XCZU48DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
533MHz, 1.333GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
366
Peripherals
DDR, DMA, PCIe
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XCZU48DR-2FFVE1156I Description

XCZU48DR-2FFVE1156I Description

The XCZU48DR-2FFVE1156I is a high-performance embedded IC chip from AMD's Zynq® UltraScale+™ RFSoC series, designed to meet the demanding requirements of modern embedded systems. This IC integrates a powerful ARM Cortex-A53 processor with a high-density FPGA fabric, offering a unique combination of processing power and programmable logic. The device features a clock speed of 533MHz and 1.333GHz, providing robust performance for a wide range of applications. It is housed in a 1156-ball BGA package, ensuring high reliability and thermal performance.

XCZU48DR-2FFVE1156I Features

  • High-Speed Processing: The XCZU48DR-2FFVE1156I offers a clock speed of 533MHz and 1.333GHz, enabling rapid data processing and handling of complex algorithms.
  • Dual Architecture: Combines a microcontroller (MCU) with a field-programmable gate array (FPGA), providing flexibility in both software and hardware design.
  • Substantial RAM Size: Equipped with 256KB of RAM, ensuring efficient data storage and retrieval for various applications.
  • Extensive I/O Capabilities: Features 366 I/O pins, supporting a wide range of peripheral connections and communication protocols.
  • Advanced Peripherals: Supports DDR, DMA, and PCIe, facilitating high-speed data transfer and efficient system integration.
  • Robust Connectivity Options: Includes CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, enabling seamless communication with various devices.
  • High Logic Cell Density: Contains over 930K logic cells, providing extensive programmable logic resources for complex designs.
  • Compliance and Packaging: The device is ROHS3 compliant, ensuring environmental sustainability. It is packaged in a tray format, suitable for automated assembly processes.
  • Moisture Sensitivity Level: MSL 4 (72 Hours), ensuring the device is protected from moisture during storage and handling.

XCZU48DR-2FFVE1156I Applications

The XCZU48DR-2FFVE1156I is ideal for applications requiring high-performance processing and flexible hardware design. Its dual architecture and extensive I/O capabilities make it suitable for:

  • Telecommunications: Ideal for baseband processing, signal processing, and network interface applications.
  • Industrial Automation: Can be used in programmable logic controllers (PLCs), robotics, and industrial IoT devices.
  • Automotive Systems: Suitable for advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units.
  • Medical Devices: Can be employed in diagnostic equipment, imaging systems, and patient monitoring devices.
  • Aerospace and Defense: Applicable in radar systems, avionics, and secure communication systems.

Conclusion of XCZU48DR-2FFVE1156I

The XCZU48DR-2FFVE1156I from AMD's Zynq® UltraScale+™ RFSoC series is a versatile and high-performance embedded IC chip, offering a unique blend of processing power and programmable logic. Its extensive features, including high-speed processing, dual architecture, and robust connectivity options, make it an ideal choice for a wide range of applications. The device's compliance with industry standards and its high logic cell density further enhance its value, making it a standout option in the embedded systems market.

FAQ

What package or case is XCZU48DR-2FFVE1156I available in?
XCZU48DR-2FFVE1156I is available in the 1156-BBGA, FCBGA package / case.
What is XCZU48DR-2FFVE1156I?
Does XCZU48DR-2FFVE1156I have quantity-based pricing?
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