AMD_XCZU7EV-3FFVF1517E
original

AMD
XCZU7EV-3FFVF1517E

777-XCZU7EV-3FFVF1517E
IC SOC CORTEX-A53 1517FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed
600MHz, 1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
464
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XCZU7EV-3FFVF1517E Description

XCZU7EV-3FFVF1517E Description

The XCZU7EV-3FFVF1517E is a high-performance System on Chip (SoC) from AMD, part of the Zynq® UltraScale+™ MPSoC EV series. This IC SOC CORTEX-A53 1517FCBGA is designed to deliver exceptional performance and flexibility, making it suitable for a wide range of demanding applications. The device features a dual-architecture design, combining a powerful MCU with an advanced FPGA, providing both high-speed processing and programmable logic capabilities.

XCZU7EV-3FFVF1517E Features

  • Speed: The XCZU7EV-3FFVF1517E operates at speeds of 600MHz and 1.5GHz, ensuring rapid processing and efficient handling of complex tasks.
  • Operating Temperature: It is designed to function reliably within a temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions.
  • Architecture: The combination of MCU and FPGA architecture allows for versatile applications, from general-purpose computing to highly customized logic functions.
  • RAM Size: With 256KB of RAM, the device can efficiently manage data storage and retrieval, enhancing overall performance.
  • ECCN: Classified under ECCN 5A002A4 XIL, this product adheres to international export control regulations.
  • Number of I/O: The device boasts 464 I/O ports, providing extensive connectivity options.
  • Peripherals: It includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing its functionality and reliability.
  • Product Status: Currently active, ensuring continued support and availability.
  • REACH Status: The XCZU7EV-3FFVF1517E is REACH unaffected, complying with stringent chemical safety regulations.
  • Connectivity: The device supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile.
  • HTSUS: Classified under HTSUS 8542.39.0001, facilitating accurate customs classification.
  • Package: Supplied in a tray package, ensuring safe and efficient handling.
  • RoHS Status: ROHS3 compliant, ensuring environmental safety and regulatory compliance.
  • Primary Attributes: The device features a Zynq® UltraScale+™ FPGA with over 504K logic cells, providing extensive programmable logic capabilities.
  • Base Product Number: XCZU7, indicating its position within the broader product family.
  • Moisture Sensitivity Level (MSL): Rated at MSL 4 (72 Hours), ensuring safe handling and storage under controlled conditions.

XCZU7EV-3FFVF1517E Applications

The XCZU7EV-3FFVF1517E is ideal for applications requiring high performance, flexibility, and extensive connectivity. Its dual-architecture design makes it suitable for:

  • Embedded Systems: Where both processing power and programmable logic are required.
  • Industrial Automation: For controlling complex machinery and processes.
  • Communication Systems: Due to its extensive connectivity options, it is well-suited for networking and communication applications.
  • Automotive: The device's robustness and wide operating temperature range make it ideal for automotive electronics.
  • Aerospace and Defense: Its high performance and reliability are crucial for mission-critical applications in these sectors.

Conclusion of XCZU7EV-3FFVF1517E

The XCZU7EV-3FFVF1517E from AMD is a versatile and powerful SoC that combines the strengths of an MCU and an FPGA. Its high-speed processing capabilities, extensive connectivity options, and robust architecture make it an excellent choice for a wide range of applications. With its compliance to international regulations and environmental standards, the XCZU7EV-3FFVF1517E ensures reliability and sustainability. This product is particularly well-suited for embedded systems, industrial automation, communication systems, automotive, and aerospace and defense applications, where high performance and flexibility are paramount.

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