AMD_XCZU7EV-L1FBVB900I
original

AMD
XCZU7EV-L1FBVB900I

777-XCZU7EV-L1FBVB900I
IC SOC CORTEX-A53 900FCBGA
16 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed
500MHz, 600MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A4 XIL
Number of I/O
204
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XCZU7EV-L1FBVB900I Description

XCZU7EV-L1FBVB900I Description

The XCZU7EV-L1FBVB900I is a high-performance System on Chip (SoC) developed by AMD, featuring a combination of a powerful ARM Cortex-A53 processor and a versatile FPGA fabric. This device is part of the Zynq® UltraScale+™ MPSoC EV series, designed to deliver exceptional performance and flexibility for a wide range of applications. The SoC integrates 504K+ logic cells, providing extensive programmable logic capabilities, and supports multiple clock speeds, including 500MHz, 600MHz, and 1.2GHz, ensuring optimal performance for various use cases.

XCZUZ7EV-L1FBVB900I Features

  • Architecture: The XCZU7EV-L1FBVB900I combines an MCU with an FPGA, offering a hybrid architecture that leverages the strengths of both processing paradigms. This dual-architecture approach enables efficient handling of both general-purpose computing tasks and highly parallel, custom logic operations.
  • RAM Size: Equipped with 256KB of RAM, this SoC provides sufficient on-chip memory to support complex applications and data-intensive tasks.
  • Connectivity: The device supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This extensive connectivity suite makes it ideal for applications requiring robust communication capabilities.
  • Peripherals: Integrated peripherals such as DMA and WDT enhance the SoC's functionality, providing efficient data transfer and system reliability.
  • I/O Count: With 204 I/O pins, the XCZU7EV-L1FBVB900I offers ample connectivity options for interfacing with various external devices and systems.
  • Compliance and Status: The SoC is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards. It also has an ECCN classification of 5A002A4 XIL, indicating its compliance with export regulations.
  • Packaging: The device is packaged in a tray format, suitable for efficient handling and integration into larger systems.
  • Moisture Sensitivity Level (MSL): With an MSL of 4 (72 Hours), the XCZU7EV-L1FBVB900I is designed to withstand moderate moisture exposure, making it suitable for a variety of manufacturing environments.

XCZU7EV-L1FBVB900I Applications

The XCZU7EV-L1FBVB900I is well-suited for a variety of applications that demand high performance, flexibility, and robust connectivity. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring real-time processing and custom logic, such as industrial control systems, medical devices, and automotive electronics.
  • Networking: The extensive connectivity options make it suitable for networking applications, including routers, switches, and communication gateways.
  • Consumer Electronics: Can be used in consumer electronics where high performance and low power consumption are critical, such as smart TVs, gaming consoles, and advanced IoT devices.
  • Aerospace and Defense: The high reliability and performance make it a good fit for aerospace and defense applications, where stringent requirements for safety and functionality are paramount.

Conclusion of XCZU7EV-L1FBVB900I

The XCZU7EV-L1FBVB900I stands out as a versatile and high-performance SoC, offering a unique combination of ARM Cortex-A53 processing and FPGA programmability. Its extensive connectivity options, robust I/O capabilities, and compliance with industry standards make it a reliable choice for a wide range of applications. Whether used in embedded systems, networking, consumer electronics, or aerospace and defense, the XCZU7EV-L1FBVB900I delivers exceptional performance and flexibility, setting it apart from similar models in the market.

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