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4306R-101-511LF

4306R-101-511LF Description

The 4306R-101-511LF from Bourns Inc. is a high-performance 5-resistor bussed network designed for precision applications in electronic circuits. With a 510Ω resistance per element and a tight ±2% tolerance, this SIP (Single In-line Package) array ensures reliable signal conditioning, voltage division, and pull-up/down functions. The device operates within a ±100ppm/°C temperature coefficient and maintains a low resistor-ratio drift of 50ppm/°C, making it suitable for stable performance across varying environmental conditions. Its compact 0.584" x 0.085" (14.83mm x 2.16mm) footprint and 4.95mm seated height allow efficient PCB space utilization. Packaged in tubes and compliant with ROHS3 and REACH, it meets stringent environmental standards.

4306R-101-511LF Features

• Bussed Circuit Configuration: Simplifies design by interconnecting resistors, reducing component count.
• 200mW Power Rating per Element: Supports moderate power dissipation for robust operation.
• Through-Hole Mounting (6-Pin SIP): Ensures mechanical stability and ease of assembly.
• Wide Operating Temperature Range: Stable performance with ±100ppm/°C TCR.
• Low Resistor-Ratio Drift (50ppm/°C): Critical for precision analog circuits.
• Non-MSAL (Moisture Sensitivity Level): Ideal for environments where moisture exposure is a concern.

4306R-101-511LF Applications

This resistor network excels in:

• Voltage Dividers: Precision attenuation in sensor interfaces or ADC circuits.
• Pull-Up/Down Networks: Signal integrity in digital systems (e.g., microcontrollers, FPGAs).
• Industrial Controls: Stable performance in PLCs, motor drives, and power supplies.
• Consumer Electronics: Space-constrained designs like smart home devices.
• Automotive Electronics: Reliable operation in infotainment or ECU modules (non-safety-critical).

Conclusion of 4306R-101-511LF

The 4306R-101-511LF combines precision, compactness, and reliability, making it a superior choice for engineers seeking a cost-effective resistor array. Its bussed topology, low drift, and RoHS3 compliance address modern design challenges, while its through-hole SIP package ensures durability. Ideal for both prototyping and mass production, this component is a versatile solution for analog and mixed-signal systems demanding consistent performance.