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4308R-101-202

4308R-101-202 Description

The 4308R-101-202 from Bourns Inc. is a high-performance 7-resistor bussed network designed for precision applications in electronic circuits. With a 2kΩ resistance per element and a tight ±2% tolerance, this through-hole-mounted array ensures reliable signal conditioning and voltage division. Its compact 0.784" x 0.085" (19.91mm x 2.16mm) footprint and 0.195" (4.95mm) height make it suitable for space-constrained designs. The device operates within a ±100ppm/°C temperature coefficient and offers 50ppm/°C resistor-ratio drift, ensuring stability across varying environmental conditions. Packaged in a tube, it is part of Bourns' 4300R series, known for robust construction and consistent performance.

4308R-101-202 Features

• 7-resistor bussed network with 8-pin SIP configuration for simplified PCB layout.
• 200mW power rating per element and ±2% tolerance for high precision.
• Low TCR (±100ppm/°C) and 50ppm/°C ratio drift for thermal stability.
• Through-hole mounting ensures mechanical durability in harsh environments.
• REACH compliant and EAR99/ECCN classified for global regulatory adherence.
• Non-MSIL (Not Applicable) moisture sensitivity, reducing handling restrictions.

4308R-101-202 Applications

Ideal for analog signal processing, voltage dividers, and impedance matching in industrial, automotive, and consumer electronics. Its bussed architecture suits pull-up/pull-down networks in digital systems, while the low drift performance benefits sensor interfaces and precision instrumentation. Commonly used in power supplies, audio equipment, and embedded control systems where space efficiency and reliability are critical.

Conclusion of 4308R-101-202

The 4308R-101-202 combines high density, thermal resilience, and ease of integration, making it a superior choice over discrete resistors. Its Bourns-quality construction and industry-standard compliance ensure long-term reliability in demanding applications. Engineers favor this model for its balance of precision, power handling, and compactness, solidifying its role in modern circuit design.