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4309R-101-153

4309R-101-153 Description

The 4309R-101-153 from Bourns Inc. is an 8-resistor bussed network array housed in a compact 9-pin SIP (Single In-line Package). Designed for through-hole mounting, it features a 15kΩ resistance per element with a tight ±2% tolerance, ensuring reliable performance in precision circuits. The array operates within a ±100ppm/°C temperature coefficient and offers a resistor-ratio drift of 50ppm/°C, making it stable under thermal stress. With a 200mW power rating per element and a low-profile 4.95mm seated height, it suits space-constrained applications. The 4300R series is REACH-compliant and comes in a protective tube package, ideal for automated assembly.

4309R-101-153 Features

• High Density: 8 resistors in a 9-pin SIP (22.45mm × 2.16mm footprint) save PCB space.
• Stable Performance: ±100ppm/°C TCR and 50ppm/°C ratio drift ensure minimal resistance variation.
• Robust Construction: Through-hole design with MSL: Not Applicable, suitable for harsh environments.
• Power Efficiency: 200mW per element handles moderate loads without derating.
• Broad Compatibility: EAR99/ECCN and HTSUS 8533.21.0050 certified for global use.

4309R-101-153 Applications

• Voltage Divider Networks: Precision ratio matching in sensor interfaces.
• Pull-up/Pull-down Arrays: Simplifies logic level stabilization in microcontrollers.
• Industrial Controls: Durable performance in PLCs and motor drives.
• Test Equipment: Stable resistance for calibration circuits.
• Consumer Electronics: Space-efficient solution for audio/video signal conditioning.

Conclusion of 4309R-101-153

The 4309R-101-153 excels in applications demanding compactness, stability, and ease of integration. Its bussed architecture reduces component count, while Bourns' quality ensures long-term reliability. Ideal for both prototyping and volume production, this resistor array bridges the gap between discrete resistors and custom networks, offering a cost-effective, standardized solution. Engineers will appreciate its balance of precision, power handling, and environmental resilience.