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4309R-101-472

4309R-101-472 Description

The 4309R-101-472 from Bourns Inc. is an 8-resistor bussed network array housed in a compact 9-pin SIP (Single In-line Package). Designed for through-hole mounting, it features a 4.7kΩ resistance per element with a tight ±2% tolerance, ensuring high precision in circuit design. The array operates within a ±100ppm/°C temperature coefficient and offers a resistor-ratio drift of 50ppm/°C, making it stable under thermal stress. With a power rating of 200mW per element, it balances performance and reliability. The device is packaged in a tube, measuring 22.45mm x 2.16mm (0.884" x 0.085") with a 4.95mm (0.195") seated height, suitable for space-constrained applications.

4309R-101-472 Features

• High Precision: ±2% tolerance and 50ppm/°C ratio drift ensure consistent performance.
• Robust Construction: Through-hole design with a moisture-insensitive MSL rating (Not Applicable).
• Thermal Stability: ±100ppm/°C temperature coefficient for reliable operation across environments.
• Compact Form Factor: Slim 2.16mm width and low-profile 4.95mm height ideal for dense PCBs.
• Bussed Circuit: Simplifies design in voltage divider or pull-up/down networks.
• REACH & ECCN Compliance: Meets environmental (REACH Affected) and export (EAR99) standards.

4309R-101-472 Applications

This resistor array excels in:

• Analog Signal Conditioning: Precision voltage division in sensor interfaces.
• Digital Pull-Up/Down Networks: Stabilizing logic levels in microcontrollers and FPGAs.
• Industrial Controls: Durable performance in PLCs and motor drives.
• Power Management: Current limiting in low-power DC/DC converters.
• Automotive Electronics: Reliable operation in infotainment and ECU systems.

Conclusion of 4309R-101-472

The 4309R-101-472 combines precision, thermal resilience, and compactness, making it a superior choice for high-reliability applications. Its bussed configuration reduces component count, while Bourns' quality ensures longevity in harsh environments. Ideal for engineers seeking a balance of performance and space efficiency in industrial, automotive, and embedded systems.