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4416P-2-391

4416P-2-391 Description

The 4416P-2-391 from Bourns Inc. is a high-performance 15-resistor bussed network designed for precision surface-mount applications. Encased in a compact 16-pin SOIC package with dimensions of 0.410" x 0.295" (10.41mm x 7.50mm) and a low-profile height of 0.114" (2.90mm), this resistor array is ideal for space-constrained PCB designs. Each resistor offers a 390Ω resistance with a tight ±2% tolerance and a ±100ppm/°C temperature coefficient, ensuring stable performance across varying environmental conditions. The device operates at 160mW power per element and features a 50ppm/°C resistor-ratio drift, making it suitable for applications requiring consistent signal integrity.

4416P-2-391 Features

• 15-resistor bussed network in a 16-pin SOIC package for efficient circuit integration.
• 390Ω resistance with ±2% tolerance and ±100ppm/°C temperature coefficient for reliable performance.
• Compact 0.410" x 0.295" footprint and low 2.90mm profile for high-density layouts.
• 160mW power rating per resistor and 50ppm/°C ratio drift for precision applications.
• Moisture Sensitivity Level (MSL) 1 (Unlimited) ensures compatibility with standard handling and storage.
• REACH Affected and ECCN EAR99 compliant for global regulatory adherence.
• Tape & Reel (TR) packaging for automated assembly efficiency.

4416P-2-391 Applications

The 4416P-2-391 excels in applications demanding precision resistor networks with minimal drift and high reliability, including:

• Voltage dividers and signal conditioning circuits in industrial control systems.
• Pull-up/pull-down networks in microcontroller and FPGA-based designs.
• Sensor interface circuits where stable resistance ratios are critical.
• Automotive electronics, benefiting from its robust ±100ppm/°C thermal stability.
• Consumer electronics requiring compact, high-density resistor arrays.

Conclusion of 4416P-2-391

The 4416P-2-391 stands out as a high-precision, space-saving resistor array from Bourns, combining low thermal drift, tight tolerance, and robust power handling in a surface-mount package. Its bussed architecture and 16-pin SOIC form factor make it a versatile choice for industrial, automotive, and consumer electronics where reliability and miniaturization are paramount. With MSL 1 compliance and Tape & Reel packaging, it is optimized for high-volume manufacturing, ensuring seamless integration into modern PCB assemblies.