GigaDevice_GD25B32EEAGR
GigaDevice_GD25B32EEAGR
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GigaDevice
GD25B32EEAGR

774-GD25B32EEAGR
IC FLASH 32MBIT SPI/QUAD 8USON
14 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 125°C (TA)
Memory Interface
SPI - Quad I/O
Memory Organization
4M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-USON (3x2)
Series
GD25B
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GD25B32EEAGR Description

GD25B32EEAGR Description

The GD25B32EEAGR is a high-performance, 32Mbit SPI/QUAD Flash memory IC chip from GigaDevice Semiconductor (HK) Limited, designed for a wide range of applications requiring reliable and efficient data storage. This memory IC chip is part of the GD25B series and is organized as 4M x 8, providing a robust solution for various electronic systems. The GD25B32EEAGR is packaged in a surface mount 8USON format, making it suitable for compact and space-constrained designs. It operates within a supply voltage range of 2.7V to 3.6V, ensuring compatibility with a variety of power supply configurations.

GD25B32EEAGR Features

  • Memory Organization: The GD25B32EEAGR features a 4M x 8 organization memory, offering a total memory size of 32Mbit. This configuration ensures efficient data storage and retrieval, making it ideal for applications requiring high-density memory solutions.
  • Mounting Type: The surface mount technology (SMT) utilized in the GD25B32EEAGR allows for easy integration into modern PCB designs. The 8USON package format further enhances its suitability for compact and space-efficient designs.
  • Voltage Range: The GD25B32EEAGR operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply requirements and ensuring compatibility with a wide range of electronic systems.
  • SPI/QUAD Interface: The GD25B32EEAGR supports both SPI and QUAD communication protocols, enabling faster data transfer rates and improved performance in applications requiring high-speed data access.
  • Product Status: The GD25B32EEAGR is an active product, ensuring long-term availability and support from GigaDevice Semiconductor (HK) Limited.
  • Packaging: The GD25B32EEAGR is available in tape and reel (TR) packaging, facilitating efficient handling and assembly processes in manufacturing environments.

GD25B32EEAGR Applications

The GD25B32EEAGR is well-suited for a variety of applications due to its high-density memory storage, efficient data transfer capabilities, and compact packaging. Key applications include:

  • Consumer Electronics: Ideal for devices such as smartphones, tablets, and digital cameras, where compact design and high-speed data access are critical.
  • Industrial Systems: Suitable for industrial control systems, IoT devices, and smart meters, where reliable data storage and efficient operation are essential.
  • Automotive Electronics: Applicable in automotive infotainment systems, advanced driver-assistance systems (ADAS), and other automotive applications requiring high-performance memory solutions.
  • Telecommunications: Used in base stations, routers, and other telecom equipment where fast data access and reliable storage are paramount.

Conclusion of GD25B32EEAGR

The GD25B32EEAGR from GigaDevice Semiconductor (HK) Limited is a versatile and high-performance 32Mbit SPI/QUAD Flash memory IC chip. Its 4M x 8 memory organization, surface mount 8USON package, and wide supply voltage range make it an ideal solution for a variety of applications across consumer electronics, industrial systems, automotive electronics, and telecommunications. The support for both SPI and QUAD interfaces further enhances its performance, making it a reliable choice for modern electronic designs. With its active product status and tape and reel packaging, the GD25B32EEAGR ensures long-term availability and ease of integration into manufacturing processes.

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